Fixture for adhering heat sink layers to backs of chips and application method thereof
A heat sink layer and chip technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of low bonding efficiency of the heat sink layer and achieve the effect of improving efficiency
Active Publication Date: 2013-04-10
JIANGNAN INST OF COMPUTING TECH
View PDF5 Cites 4 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] The problem solved by the embodiments of the present invention is to provide a jig for bonding the heat sink layer on the back of the chip and a method for bonding the chip by using the jig, which solves the problem of low bonding efficiency of the existing heat sink layer
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0033] The prior art employs operators to manually bond the heat sink layer on the backside of the chip, which makes bonding the heat sink layer inefficient.
[0034] In order to solve the above problems, an embodiment of the present invention provides a chip holder, including:
[0035] A first jig layer, the first jig layer is provided with a plurality of chip vacancies, and the chip vacancies are used to place chips;
[0036] A second jig layer, wherein a plurality of heat sink layer vacancies are arranged in the second jig layer, and the shape, number and distribution of the heat sink layer vacancies correspond to the shape, number and distribution of the chip vacancies;
[0037] An intermediate clamping layer, located between the first clamping layer and the second clamping layer, one side of the intermediate clamping layer is adjacent to the back of the chip, and the other side is adjacent to the heat sink layer, and the intermediate clamping layer is formed There is a g...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
An embodiment of the invention provides a fixture for chips. The fixture comprises a first fixture layer, a second fixture layer, a middle fixture layer and a positioning hole, wherein a plurality of chip vacancies are arranged in the first fixture layer and used for accommodating chips; a plurality of heat sink layer vacancies are arranged in the second fixture layer, and shapes, the number and the distribution of the heat sink layer vacancies correspond to shapes, the number and the distribution of the chip vacancies; the middle fixture layer is positioned between the first fixture layer and the second fixture layer, one side of the middle fixture layer is adjacent to the backs of the chips, the other side of the middle fixture layer is adjacent to the heat sink layers, and adhesive spilling space for accommodating spilled adhesive between the chips and the heat sink layers is formed in the middle fixture layer; and the positioning hole penetrates through the three fixture layers and is used for fixing the three fixture layers. According to the fixture and an application method thereof, the adhering efficiency of the heat sink layers on the backs of the chips is improved.
Description
technical field [0001] The embodiments of the present invention relate to the field of packaging, in particular to a jig for bonding a heat sink layer on the back of a chip and a method for bonding a chip by using the jig. Background technique [0002] In the existing packaging technology, the PCB substrate and the wafer are usually packaged with a packaging resin to form an initial packaging structure. The wafer usually includes a plurality of independent integrated circuit chips, and the PCB substrate usually includes a plurality of substrate units corresponding to the integrated circuit chips. After the initial packaging structure is formed, a dicing process is generally required to divide the initial packaging structure into a plurality of independent chips. [0003] In order to improve the heat dissipation capability of the chip, in the prior art, a heat sink layer (heat sink) is usually formed on the back of the independent chip (the back is the surface of the chip on...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L21/48
Inventor 孙忠新高锋刘晓阳张涛吴小龙梁少文胡广群
Owner JIANGNAN INST OF COMPUTING TECH