Thermal resistance test device and method of semiconductor power device

Abstract

The invention relates to a thermal resistance test device and method of a semiconductor power device. The test device comprises a test machine, and a temperature control box and a static air box which are respectively connected with the test machine, wherein a temperature control device and a first connector are arranged in the temperature control box, and a first temperature probe, a second temperature probe and a second connector are arranged in the static air box; and the test machine comprises a microprocessor, and a voltage test module, a constant power output module, a drive power module and a temperature acquisition module which are respectively connected with the microprocessor, and the microprocessor is also connected with the temperature control device. According to the test device and method provided by the invention, the lower-cost temperature probes are used to detect the temperature, and the constant power is applied in the process of heating a device to be tested, so that the test cost is reduced, and the precision of thermal resistance test is further ensured. The device and the method have the characteristics of wide measurement coverage, high measurement precision, simple test and low cost.

Description

technical field [0001] The invention relates to the technical field of semiconductor power device measurement, in particular to a semiconductor power device thermal resistance testing device and method. Background technique [0002] Semiconductor power devices are often damaged due to high junction temperature due to heat during operation. Therefore, it is very necessary to control the junction temperature of semiconductor power devices during operation. The junction temperature can be calculated from the thermal resistance and shell temperature of semiconductor power devices. . The design of the thermal resistance tester in the prior art, on the one hand, is in order to objectively evaluate the thermal resistance of the semiconductor power device, rationally design the PCB and the cooling element, make the junction temperature of the semiconductor power device not exceed the safe area in the working process, and guarantee the semiconductor power device. Safe and normal ope...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a high measurement accuracy, simple test, wide measurement coverage and a Low-cost semiconductor power device thermal resistance testing device and method

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