Apparatus and method for heat treating a plurality of multilayer bodies
A body and cooling device technology, applied in transportation and packaging, semiconductor devices, lighting and heating equipment, etc., can solve problems such as poor integration, discontinuous batch operation of stacking furnaces, etc., to achieve the effect of uniform heat distribution
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[0062] figure 1 The device for thermally treating a multilayer body according to the invention is illustrated by way of example of an in-line device ( 1 ) for selenizing precursor layers by rapid thermal processing (RTP). The inline plant ( 1 ) has a heating chamber ( HK1 ) and a cooling chamber ( KK1 ) arranged one behind the other in the conveying direction ( 11 ). The inline system ( 1 ) has two process levels ( 3.1 ) and ( 3.2 ), which are arranged vertically one above the other. A horizontal configuration is likewise provided according to the invention. In the heating chamber ( HK1 ), a radiator array ( 2.1 ) is arranged above the upper process level ( 3.1 ) and a radiator array ( 2.3 ) is arranged below the lower process level ( 3.2 ). Furthermore, a radiator array ( 2.2 ) is arranged between the process levels ( 3.1 ) and ( 3.2 ).
[0063] In the cooling chamber ( KK1 ), a cooling plate ( 7.1 ) is arranged above the upper process level ( 3.1 ) and a cooling plate ( 7...
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