Environment-friendly glue solution for LED full-color display, copper clad laminate and preparation method thereof

A display screen and environment-friendly technology, applied in chemical instruments and methods, circuit substrate materials, lamination, etc., can solve problems such as high energy consumption, achieve the effects of reducing product energy consumption, reducing usage, and improving product performance

Active Publication Date: 2013-04-24
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide an environment-friendly glue for LED full-color display, a copper-clad laminate and a

Method used

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  • Environment-friendly glue solution for LED full-color display, copper clad laminate and preparation method thereof
  • Environment-friendly glue solution for LED full-color display, copper clad laminate and preparation method thereof
  • Environment-friendly glue solution for LED full-color display, copper clad laminate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] Example 1

[0031] Raw material components of glue (parts by weight):

[0032]

[0033] Glue preparation method: mix ethylenediamine, benzyl-2-aniline and acetone, stir at 1000rpm for 4 hours; when it is completely dissolved, add phenolic epoxy resin, stir fully at 1200rpm for 3 hours After mixing uniformly, add talc powder, shear and disperse at a high speed of 3500 rpm for 45 minutes, then stir at a speed of 1200 rpm for 6 hours, and it will be fully matured.

[0034] The copper clad laminate is prepared by a manufacturing method commonly used in the field, and the process of gluing, lamination, pressing, disassembly, and processing is carried out in sequence.

[0035] Among them, the gluing process is: coating the electronic grade glass fiber cloth on the gluing machine with the above-prepared glue liquid, and drying it to form a gel to obtain a prepreg. The process parameters are: the oven temperature of the gluing machine is 170℃, the gluing speed is 12m / min, the mass per...

Example Embodiment

[0039] Example 2

[0040] Raw material components of glue (parts by weight):

[0041]

[0042] Glue preparation method: mix 2-amino-2-phenylmethane, 2-methylimidazole and dimethylformamide, stir at 1500rpm for 2 hours; when it is completely dissolved, add bisphenol A ring The oxygen resin is fully stirred at 1000 rpm for 5 hours; after mixing is uniform, magnesium hydroxide is added, and high-speed shearing and dispersing at 5000 rpm for 30 minutes, and then stirred at 1500 rpm for 6 hours, and it is fully cured.

[0043] The copper clad laminate is prepared by a manufacturing method commonly used in the field, and the process of gluing, lamination, pressing, disassembly, and processing is carried out in sequence.

[0044] Among them, the gluing process is: coating the electronic grade glass fiber cloth on the gluing machine with the above-prepared glue liquid, and drying it to form a gel to obtain a prepreg. The process parameters are: the oven temperature of the gluing machine is 2...

Example Embodiment

[0048] Example 3

[0049] Raw material components of glue (parts by weight):

[0050]

[0051] Glue preparation method: mix phthalic anhydride, triethanolamine and ethylene glycol methyl ether, stir at 800 rpm for 3 hours; after it is completely dissolved, add brominated epoxy resin, and fully rotate at 1300 rpm Stir for 4 hours; after mixing uniformly, add zinc borate, disperse at high speed at 2500 rpm for 120 minutes, then stir at 1000 rpm for 8 hours, and it will be fully cured.

[0052] The copper clad laminate is prepared by a manufacturing method commonly used in the field, and the process of gluing, lamination, pressing, disassembly, and processing is carried out in sequence.

[0053] Among them, the gluing process is: coating the electronic grade glass fiber cloth on the gluing machine with the above-prepared glue liquid, and drying it to form a gel to obtain a prepreg. The process parameters are: the oven temperature of the gluing machine is 200℃, the gluing speed is 15m / mi...

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Abstract

The invention discloses an environment-friendly glue solution for an LED (Light-Emitting Diode) full-color display, a copper clad laminate (CCL) and a preparation method thereof. The environment-friendly glue solution for the LED full-color display comprises the following raw materials by weight: 450-500 parts of resin, 8-12 parts of curing agent, 0.2-0.3 part of curing accelerator, 100-120 parts of solvent and an organic filler that accounts for 10-70% of the total mass of the glue solution. According to the invention, the organic filler is added to the glue solution so as to replace a glass fabric, and the CCL can greatly reduce the usage amount of the glass fabric and has high heat dissipation performance, high conductivity and high heat resistance simultaneously, so that the production energy consumption can be reduced, and the product performance can be further improved.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a glue solution for an environment-friendly LED full-color display, a copper-clad laminate and a preparation method thereof. Background technique [0002] After the light-emitting diode (LED) is directly installed on the pattern of the printed circuit board (PCB), it is manufactured into a chip LED by resin packaging. These chip LEDs are easy to miniaturize, and have been used in electronic equipment such as mobile phones and backlights of small liquid crystal displays. In recent years, the brightness of LEDs has been significantly increased, and small products such as chip LEDs have not only obtained sufficient brightness, but also developed very complicated structures. As the brightness of LED increases, it has begun to be used in liquid crystal display or commodity display lighting. On the one hand, it is strongly required that LEDs have a technological development tren...

Claims

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Application Information

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IPC IPC(8): B32B15/092B32B15/08B32B15/095B32B27/04B32B27/20C08L63/04C08L63/02C08L63/00C08L35/00C08L75/04C08K13/02C08K3/34C08K3/22C08K3/36C08K3/38C08K3/24C08K3/26C08K3/30B32B37/10H05K1/03
Inventor 韩涛胡瑞平
Owner SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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