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Joined structural body of members, joining method of members, and package

A technology for bonding structures and bonding methods, which can be used in printed circuit parts, semiconductor/solid-state device parts, electrical components, etc., and can solve problems such as deterioration of electronic device characteristics and reduction of reliability

Inactive Publication Date: 2013-05-01
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These warpages or deformations are the main cause of deteriorating the characteristics of electronic devices and reducing reliability.

Method used

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  • Joined structural body of members, joining method of members, and package
  • Joined structural body of members, joining method of members, and package
  • Joined structural body of members, joining method of members, and package

Examples

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Embodiment Construction

[0020] Embodiments will be described below with reference to the drawings. In the drawings, the same symbol indicates the same or similar parts. refer to Figure 1A as well as Figure 1B The first embodiment will be described.

[0021] Figure 1A as well as Figure 1B It is a schematic diagram which shows the package of 1st Embodiment. Figure 1A is the plan view of the package body, Figure 1B is along Figure 1A The cross-sectional view of the line Ib-Ib in. The package accommodates, for example, electronic devices such as semiconductor elements, optical semiconductor elements, and piezoelectric elements therein.

[0022] exist Figure 1A Among them, the package 10 includes a substrate 3 as a first component, a housing 5 as a second component, and two feed through terminals (or connection terminals: feed through terminal) 7 . The substrate 3 has a device mounting portion 12 on which an electronic device (not shown) and its peripheral circuit elements are adhered, and a ...

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PUM

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Abstract

The invention provides a joined structural body for storing or carrying a member of an electronic component. The joined structural body is provided with a first member, a second member and a joining portion. The joining portion is provided between the first member and the second member so as to connect the first member and the second member with each other mechanically. The joining portion contains at least one metal of a tin, an indium or a zinc, and a copper. The content of the metal in the joining portion decreases toward a side of at least one of the first member and the second member, and the content of the copper in the joining portion increases in the same direction as the decreasing direction of the content of the metal.

Description

technical field [0001] All of the embodiments described here relate to a component joining structure, a component joining method, and a package. [0002] This application is based on and claims the benefit of priority of Japanese Patent Application No. 2011-235385 filed on October 26, 2011, and pursues the benefits thereof, the entire contents of which are hereby incorporated by reference. Background technique [0003] An electronic device typified by a semiconductor element is bonded to a substrate supporting it, and mounted on a substrate such as a mounting substrate. Most electronic devices are hermetically packaged inside a package including a substrate in order to increase their reliability. Such substrates and packages are required to be stable to the temperature of electronic devices during soldering or operation. Therefore, a plurality of components constituting a substrate or a package are joined using, for example, silver solder whose melting point is higher than...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L21/60
CPCH01L2924/13091H01L23/047H01L2924/01327H01L23/49531H01L2924/3011H01L23/10H01L2224/49175H01L23/66H01L2224/48105H01L2224/48157H01L24/10H01L2924/13062Y10T428/12458H01L2924/00H01L23/48H05K1/09H05K1/115
Inventor 高木一考
Owner KK TOSHIBA