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Light emitting element, method of manufacturing the same, and light emitting device

A technology of light-emitting elements and elements, applied in electrical components, semiconductor devices, circuits, etc., can solve the problems of increasing the area ratio of the non-light-emitting part and reducing the luminous efficiency, so as to increase the light-emitting area, improve the light-emitting efficiency, and suppress the non-light-emitting area. compound effect

Active Publication Date: 2013-05-01
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As light-emitting elements progress toward miniaturization, the area ratio of the non-light-emitting portion caused by the non-light-emitting recombination at the end faces as described above increases, resulting in a decrease in luminous efficiency

Method used

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  • Light emitting element, method of manufacturing the same, and light emitting device
  • Light emitting element, method of manufacturing the same, and light emitting device
  • Light emitting element, method of manufacturing the same, and light emitting device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0045] Example in which the end face of the active layer is covered with a crystalline film

[0046] 2. Modification 1

[0047] An example in which the crystalline film includes a multilayer film

example 2

[0049] An example in which an insulating part is included in the end part of the laminated body

[0050] 4. The second embodiment

[0051] Example in which a diffusion portion is provided in an end portion of an active layer

[0052] 5. Modification 3

[0053] An example in which an insulating part is included in the end part of the laminated body

[0054] 6. The third embodiment

[0055] These include examples of crystalline films and diffused parts

[0056] 7. Modification 4

[0057] An example in which an insulating part is included in the end part of the laminated body

[0058] 8. Application example

[0059] 1. The first embodiment

[0060] Figure 1A and Figure 1B The configuration of the light-emitting element (light-emitting element 1 ) of the first embodiment of the present invention is shown. Figure 1A represents the top surface (plane) structure of the light-emitting element 1, and Figure 1B means along Figure 1A Line B-B in the cross-sectional configur...

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Abstract

The invention relates to a light emitting element, a method of manufacturing the same, and a light emitting device. The light emitting element includes: a laminated body including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer in this order, the second conductive semiconductor layer having a light extraction surface; and a recombination suppression structure provided in vicinity of an end surface of the active layer, the recombination suppression structure having a bandgap larger than a bandgap of the active layer. According to the invention, the nonradiative recombination at the end surface of the active layer is suppressed and its light emission efficiency is improved.

Description

[0001] Cross References to Related Applications [0002] This application contains information related to the disclosures of Japanese Priority Patent Application JP 2011-234637 filed with the Japan Patent Office on October 26, 2011 and Japanese Priority Patent Application JP 2011-283570 filed with the Japan Patent Office on December 26, 2011 subject matter, the entire content of said prior application is hereby incorporated by reference. technical field [0003] The present invention relates to a light-emitting element, a method of manufacturing the light-emitting element, and a light-emitting device, the light-emitting element being suitable for, for example, a light emitting element having a thickness of 2500 μm 2 Micro LEDs (Light Emitting Diodes) with smaller light emitting areas. Background technique [0004] In order to apply light-emitting elements to printers and displays, miniaturization of light-emitting elements such as light-emitting diodes (LEDs) has been studi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/44H01L33/04
CPCH01L33/02H01L33/44H01L33/04
Inventor 横关弥树博小山享宏成井启修青柳秀和塩见治典河崎孝彦伊藤胜利
Owner SONY CORP