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Light-emitting element, method of manufacturing light-emitting element, and light-emitting device

A technology of light-emitting components and elements, which is applied in the direction of electrical components, semiconductor devices, circuits, etc., can solve the problems of reduced luminous efficiency and increased area ratio of non-luminous parts, so as to increase the luminous area, improve luminous efficiency, and suppress non-luminous composite effect

Inactive Publication Date: 2017-08-11
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As light-emitting elements progress toward miniaturization, the area ratio of the non-light-emitting portion caused by the non-light-emitting recombination at the end faces as described above increases, resulting in a decrease in luminous efficiency

Method used

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  • Light-emitting element, method of manufacturing light-emitting element, and light-emitting device
  • Light-emitting element, method of manufacturing light-emitting element, and light-emitting device
  • Light-emitting element, method of manufacturing light-emitting element, and light-emitting device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0045] Example in which the end face of the active layer is covered with a crystalline film

[0046] 2. Modification 1

[0047] An example in which the crystalline film includes a multilayer film

example 2

[0049] An example in which an insulating part is included in the end part of the laminated body

[0050] 4. The second embodiment

[0051] Example in which a diffusion portion is provided in an end portion of an active layer

[0052] 5. Modification 3

[0053] An example in which an insulating part is included in the end part of the laminated body

[0054] 6. The third embodiment

[0055] These include examples of crystalline films and diffused parts

[0056] 7. Modification 4

[0057] An example in which an insulating part is included in the end part of the laminated body

[0058] 8. Application example

[0059] 1. The first embodiment

[0060] Figure 1A and Figure 1B The configuration of the light-emitting element (light-emitting element 1 ) of the first embodiment of the present invention is shown. Figure 1A represents the top surface (plane) structure of the light-emitting element 1, and Figure 1B means along Figure 1A Line B-B in the cross-sectional configur...

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Abstract

The present invention relates to a light emitting element, a method of manufacturing the light emitting element, and a light emitting device including the light emitting element. The light emitting element includes: a laminated body sequentially including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer having a light extraction surface; and a recombination suppression structure provided on the active layer. Near the end face of the layer, the bandgap of the composite suppression structure is larger than the bandgap of the active layer. According to the present invention, it is possible to suppress non-luminous recombination at the end face of the active layer and improve luminous efficiency.

Description

[0001] Cross References to Related Applications [0002] This application contains information related to the disclosures of Japanese Priority Patent Application JP 2011-234637 filed with the Japan Patent Office on October 26, 2011 and Japanese Priority Patent Application JP 2011-283570 filed with the Japan Patent Office on December 26, 2011 subject matter, the entire content of said prior application is hereby incorporated by reference. technical field [0003] The present invention relates to a light-emitting element, a method of manufacturing the light-emitting element, and a light-emitting device, the light-emitting element being suitable for, for example, a light emitting element having a thickness of 2500 μm 2 Micro LEDs (Light Emitting Diodes) with smaller light emitting areas. Background technique [0004] In order to apply light-emitting elements to printers and displays, miniaturization of light-emitting elements such as light-emitting diodes (LEDs) has been studi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/44H01L33/04
CPCH01L33/02H01L33/44
Inventor 横关弥树博小山享宏成井启修青柳秀和塩见治典河崎孝彦伊藤胜利
Owner SONY CORP