Cleaning machine with twin-jet nozzle
A cleaning device and dual-nozzle technology, which are applied to spray devices, cleaning methods and utensils, cleaning methods using liquids, etc., can solve the problem that the particles on the surface of the wafer cannot be washed away, and achieve simple structure, low price, and improved cleaning efficiency. and the effect of edge cleaning time
Active Publication Date: 2015-06-17
SHENYANG KINGSEMI CO LTD
View PDF4 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] In order to solve the problem that the traditional cleaning method cannot fully and effectively wash away the particles on the surface of the wafer, the purpose of the present invention is to provide a dual-nozzle cleaning device
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0017] The present invention will be described in further detail below with reference to the drawings.
[0018] Such as figure 1 , figure 2 As shown, the present invention includes a nozzle electric cylinder 1, a spindle motor 2, a wafer table 3, a housing 4, a nozzle arm 7, a spindle 9 and a worktable 10, wherein the spindle motor 2 is installed on the worktable 10, and the spindle 9 One end is connected with the output end of the spindle motor 2, and the other end is equipped with a carrier table 3, the wafer 8 is fixed on the carrier table 3, and the spindle motor 2 drives the carrier table 3 to rotate together. A casing 4 mounted on the worktable 10 is provided on the outer side of the wafer table 3. The housing 4 is cylindrical and is used to collect the liquid that has cleaned the wafer 8. The wafer table 3 is located inside the housing 4 intermediate. The nozzle electric cylinder 1 is installed on one side of the worktable 10. One end of the nozzle arm 7 is connected to ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to the equipment which is used for cleaning the chip in the workpiece process of semiconductor chips, in particular to a cleaning machine with a twin-jet nozzle used for optimizing the washing of the surface of the chip. The cleaning machine comprises a nozzle electric cylinder, a spindle motor, a supporting stage, a shell body, a nozzle arm, a spindle and a workbench. The spindle motor is installed on the workbench and one end of the spindle is connected with an output end of the spindle motor and the other end of the spindle motor is installed inside the shell body of the workbench. The other end of the spindle is connected with the supporting stage used for fixing and rotating the chip. The nozzle electric cylinder is installed on one side of the workbench and one end of the nozzle arm is connected with the nozzle electric cylinder and is in reciprocating motion through the drive of the nozzle electric cylinder. The other end of the nozzle arm is located above the chip and the other end of the nozzle arm is provided with the twin-jet nozzle corresponding to the chip. The cleaning machine with the twin-jet nozzle can meet the cleaning demand to the hilt through the control of the position of the nozzle and the characteristic of the rotation of the chip in the cleaning process and achieve the cleaning goal that all particles on the surface of the chip are cleared away.
Description
Technical field [0001] The invention relates to a device for cleaning wafers in the processing of semiconductor wafers, in particular to a double nozzle cleaning device for optimally cleaning the surface of the wafer. Background technique [0002] At present, a highly clean environment is required during semiconductor wafer processing to reduce the impact of unnecessary particles on the process. However, with the continuous improvement of precision, the continuous reduction of line width and the continuous improvement of cleanliness requirements, not only a high-cleanliness purification environment is required, but in many cases, the surface of the wafer needs to be cleaned to meet the needs of the processed wafer Surface cleanliness requirements. [0003] The original wafer cleaning method is to fix the wafer on the wafer table by vacuum adsorption, and use deionized water to directly rinse the lens surface. In this way, the centrifugal force when the wafer table drives the wafe...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67B08B3/02B05B15/10
Inventor 张浩渊
Owner SHENYANG KINGSEMI CO LTD