Connector of integrated circuit (IC)
A technology of integrated circuits and connectors, applied in the field of new connectors, can solve the problems of virtual welding, bridging, difficult replacement and improvement of integrated circuit ICs, etc., to achieve the effect of ensuring reliability and avoiding virtual welding
Inactive Publication Date: 2013-06-05
苏州派立康电子科技有限公司
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- Abstract
- Description
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- Application Information
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Problems solved by technology
[0003] In order to avoid the problems of virtual soldering, bridging, damage and difficulty of replacement during the welding process of the existing integrated circuit IC and the circuit board, and improve the heat conduction channel of the integrated circuit IC
Method used
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Embodiment Construction
[0012] exist figure 1 Among them, the integrated circuit IC 2, the new connector 1, and the circuit board 3 are installed as shown in the figure. By pressing the integrated circuit 2 and the circuit board 3 , the novel connector 1 is in close contact with the integrated circuit 2 and the circuit board 3 to realize reliable electric conduction and heat conduction. When the electrical signal enters the high-density flexible connector 5 from the circuit board 3 and is output to the integrated circuit IC 2 , a loop is formed to realize the normal operation of the integrated circuit IC 2 . In addition, when the integrated circuit IC 2 generates heat, the heat can be transferred through the soft heat-conducting material 6 in the new connector 1 in contact with the IC packaging shell to dissipate heat.
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A novel connector is used for connecting an integrated circuit (IC) with a circuit board. The high-density and soft connector is combined with heat conduction material. The IC, the novel connector and the circuit board are closely contacted with each other through press fit of the IC and the circuit board, and therefore transmission of electric signals and reliability of heat conduction are guaranteed. The novel connector has the advantages of being capable of providing a lower portion heat conduction channel for the IC, enabling heat dissipation not to be in simplification, and further avoiding poor phenomena of cold solder joint, bridge welding and the like caused by the welding technology due to the fact that welding is not needed. The IC is capable of being freely replaced along with disassembly.
Description
Technical field [0001] The invention relates to the field of integrated circuits (ICs), in particular to a novel connector used for connecting an integrated circuit (IC) to a circuit board. Background technique [0002] At present, the connection between the integrated circuit IC and the circuit board is generally adopted by welding, but if the pins are not well welded, bridging, virtual welding and other undesirable phenomena will occur, which seriously affects the welding quality of the conductive channel, and the conduction is unreliable. And if the soldering temperature is too high, it will damage the chip. In addition, once the integrated circuit IC is damaged, it is not easy to replace because it is connected by welding. On the other hand, the current high-power integrated circuit IC dissipates heat through a heat sink on the upper part, without providing a heat conduction channel in the lower part, and the heat conduction channel is single. In applications with limit...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01R13/00H01R13/02H01R13/46H01R12/51H01R33/74
Inventor 吴德人
Owner 苏州派立康电子科技有限公司