Light emitting diode (LED) and down-straight type backlight source
A technology of light-emitting diodes and electrodes, which is applied in the field of direct-lit backlight sources, can solve the problems of small light intensity of laterally emitted light, burnout, and high temperature of light-emitting diodes that cannot work normally.
Active Publication Date: 2013-06-19
ZHANJING TECH SHENZHEN +1
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Problems solved by technology
However, the light intensity of a single light-emitting diode emitted sideways is relatively small. When using this light-emitting diode to manufacture a backlight, it is necessary to arrange multiple light-emitting diodes densely on a panel.
Due to the large number of LEDs used and the small distance between each LED, each LED generates more heat during operation, and several hot spots (hot spots) will appear in the backlight due to heat accumulation. If If the heat is not dissipated in time, the temperature of the LED will be too high to work normally, or even burn out.
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[0016] Such as figure 1 and figure 2 Shown is a light emitting diode of a preferred embodiment of the present invention, the light emitting diode 100 includes a substrate 10, a light emitting diode chip 11, first and second connectors 12, 12a, first and second electrodes 13, 13a, An encapsulation layer 14 and a reflective layer 15 .
[0017] The substrate 10 defines a groove 101 . A layer of reflective material is provided on the bottom surface of the groove 101 to form the reflective layer 15 . The reflective layer 15 includes a first reflective layer 151 located at the center of the bottom surface of the groove 101, a second reflective layer 152 surrounding the periphery of the first reflective layer 151 and connected to the first reflective layer 151, and a second reflective layer 152 surrounding the second reflective layer 151. A third reflective layer 153 is formed around the reflective layer 152 and connected to the second reflective layer 152 . Surfaces of the firs...
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A light emitting diode (LED) comprises a substrate, an LED chip, a first electrode, a second electrode, a sealing layer and a reflecting layer. The substrate is provided with a groove, the reflecting layer is attached to the bottom face of the groove, the LED chip is placed inside the groove and placed above the reflecting layer, and the sealing layer is filled in the groove of the substrate to cover the reflecting layer and wrap the LED chip. The reflecting layer comprises a first reflecting layer and a second reflecting layer. The first reflecting layer is placed in the center of the bottom face of the groove, and the second reflecting layer surrounds the periphery of the first reflecting layer and is connected with the first reflecting layer. The surface of the first reflecting layer is a convex face, and the surface of the second reflecting layer is a concave face. The LED chip is electrically connected with the first electrode and the second electrode, and the LED chip is provided with a light-emitting face which is opposite to the reflecting layer. The invention further provides a down-straight type backlight source with the LED.
Description
technical field [0001] The invention relates to a light-emitting diode and a direct-down backlight source using the light-emitting diode. Background technique [0002] Light-emitting diodes are energy-saving, environmentally friendly, and long-life solid-state light sources. Therefore, the research on light-emitting diode technology has been very active in the past ten years, and light-emitting diodes are gradually replacing traditional light sources such as fluorescent lamps and incandescent lamps. [0003] The light-emitting diodes in the prior art generally include a substrate, a reflective layer, a light-emitting diode chip and a packaging layer, the reflective layer is attached to the surface of the substrate, the light-emitting diode chip is located above the reflective layer, and the light-emitting diode chip has an orientation On the light emitting surface of the reflective layer, the encapsulation layer covers the reflective layer and wraps the LED chip. The light ...
Claims
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IPC IPC(8): H01L25/075H01L33/64H01L33/60F21S8/00F21V19/00F21Y101/02F21Y115/10
Inventor 张超雄林厚德
Owner ZHANJING TECH SHENZHEN