Supercharge Your Innovation With Domain-Expert AI Agents!

Circuit solder resist method of printed circuit board

A printed circuit board and solder resist technology, which is applied in the field of printing and manufacturing, can solve problems such as poor high temperature resistance of printed circuit boards, affecting the quality of printed circuit boards, and damage to printed circuit boards, so as to avoid solder resist warping and thickening Solder mask thickness, effect of increasing solder mask thickness

Inactive Publication Date: 2013-07-10
XINLI MACHINERY LIYANG CITY
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this method will cause damage to the printed circuit board, because the way of oven hardening must rely on a certain high temperature, and the material of the printed circuit board itself is not strong in high temperature resistance, and the components on the circuit board will also be affected by certain temperatures at high temperatures. degree of damage, which ultimately affects the quality of the printed circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0021] The circuit welding resistance method of the printed circuit board that the present invention proposes, it comprises the following steps in sequence:

[0022] A circuit soldering method for a printed circuit board, which comprises the following steps in sequence:

[0023] (1) Print light-hardening nano-silver-copper alloy conductive ink on the surface of the printed circuit board, wherein the nano-silver-copper conductive ink includes the following components by mass percentage:

[0024] Light hardening nano-silver copper alloy powder: 20%~50%, solvent: 20%~85%, additive: 5%~10%, photoinitiator 5~8%, defoamer 1.5%, leveling agent 1.5% %. Wherein, the particle size distribution range of the nano-silver-copper alloy particles is 10nm-80nm.

[0025] Wherein, the contents of silver and copper in the nano-silver-copper alloy particles are, by mass percentage, respectively: silver: 5% to 10%, copper: 80% to 95%; preferably, the silver and copper in the nano-silver-copper al...

Embodiment approach 2

[0041] The circuit welding resistance method of the printed circuit board that the present invention proposes, it comprises the following steps in sequence:

[0042] A circuit soldering method for a printed circuit board, which comprises the following steps in sequence:

[0043] (1) Print light-hardening nano-silver-copper alloy conductive ink on the surface of the printed circuit board, wherein the nano-silver-copper conductive ink includes the following components by mass percentage:

[0044] Light hardening nano-silver copper alloy powder: 20%~50%, solvent: 20%~85%, additive: 5%~10%, photoinitiator 5~8%, defoamer 1.5%, leveling agent 1.5% %. Wherein, the particle size distribution range of the nano-silver-copper alloy particles is 50nm.

[0045] Wherein, the contents of silver and copper in the nano-silver-copper alloy particles are respectively 7% and 93% by mass percentage.

[0046]Wherein, the solvent includes: one or more of water, alcohols, ethers and esters; wherei...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a circuit solder resist method of a printed circuit board. The circuit solder resist method of the printed circuit board sequentially comprises the follow steps: (1) printing photo-hardening nano-silver-copper alloy conductive ink on the board surface of the printed circuit board; (2) irradiating the printed circuit board which is printed with the photo-hardening nano-silver-copper alloy conductive ink under ultraviolet light till the nano-silver-copper alloy conductive ink is solidified; (3) printing solder resist ink in a silk-screen mode on the printed circuit board after the step (2) is finished so that a first solder resist layer is formed after the solder resist ink is dried; and (4) printing the solder resist ink on the first solder resist layer so that a second solder resist layer is formed after the solder resist ink is dried.

Description

Technical field: [0001] The invention relates to printing and manufacturing technology, in particular to a circuit soldering resistance method of a printed circuit board. Background technique: [0002] The solder resist ink of the printed circuit board is an insulating material, which is printed on the circuit board to form a solder resist layer, and plays the role of insulation and preventing soldering in the printed circuit board. The solder resist layer is formed of a permanent polymer solder resist coating material, and the solder resist layer covers most of the printed circuits, only exposing pads for parts welding, electrical performance testing and circuit board insertion. When the thickness of the circuit on the printed circuit board is greater than 100 microns, steps will be formed on the printed circuit board substrate between the surface of the circuit and the spacing, and the thickness of the solder mask at the corner of the step is generally higher than other pa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28C09D11/02C09D11/52
Inventor 曹小真陈信华
Owner XINLI MACHINERY LIYANG CITY
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com