A kind of manufacturing process of electroforming template

Abstract

A production process for an electroformed stencil. The production process aimed at producing an electroformed stencil having a printing surface with up steps, wherein the up step area has opening patterns, and having a PCB surface with down steps, wherein the down step area has no openings. The production process is as follows: electroforming a first electroformed layer: core mold treatment->pre-treatment (degreasing, pickling and sandblasting)->film mounting 1->exposure 1->single sided development 1->electroforming 1; electroforming a second electroformed layer (forming down steps on the PCB surface): pre-treatment (pickling and sandblasting)->film mounting 2->exposure 2->single sided development 2-> electroforming 2->stripping; and electroforming up steps on the printing surface: printing surface film mounting->exposure 3->single sided development 3->electroforming 3->film stripping->mold stripping->follow-up treatment (degreasing and pickling). According to the electroformed stencil produced by using the production process, the pattern openings of the up step area is in high position alignment precision with the first electroformed openings; the thickness uniformity COV of the stencil is less than 10%; the stencil surface is in first grade brightness; and the bonding strength is strong between each electroformed layer, without the proneness of falling off.

Description

technical field [0001] The invention relates to a manufacturing process of an electroforming template, belonging to the field of material manufacturing and processing. In particular, it relates to a process for preparing a printing mask with a raised step (up step) on the printing surface and a depressed step (downstep) on the PCB surface in the field of SMT by using electroforming. Background technique [0002] With the pursuit of miniaturization of electronic products, the perforated plug-in components used before can no longer be reduced; the functions of electronic products are more complete, and the integrated circuits (ICs) used can no longer perforate components, especially large-scale and highly integrated ICs, which have to use surface SMT components, so the stencil printing process has developed rapidly in the electronics manufacturing industry, and SMT printing is a typical example. The procurement of templates is not only the first step in the SMT assembly proce...

AI Technical Summary

Problems solved by technology

[0005] For the technology of local thickening, the key point is that the opening position of the up step graphic area and the opening position of the substrate graphic area should be high, and the auxiliary shunt plate used for the up step graphic area to share the current, and the bonding force should be large at the same time, otherwise the service life will greatly reduce

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