Wafer temporary storage clamping case

A wafer and cassette technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as wafer cracking and damage, and achieve the effect of reducing malfunctions

Active Publication Date: 2013-07-17
CHIPMOS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when transporting the temporary wafer storage cassette storing the wafers to the next workstation, the operator often forgets to release the stop member to limit the wafers, which causes the mechanical arm to forcibly take out the wafers from the opening, resulting in Cracked and damaged by the round hitting the stop member
In addition, the slot pitch of the temporary waf

Method used

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  • Wafer temporary storage clamping case
  • Wafer temporary storage clamping case
  • Wafer temporary storage clamping case

Examples

Experimental program
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Effect test

Example Embodiment

[0060] figure 1 It is a three-dimensional schematic diagram of a temporary wafer storage cassette according to an embodiment of the present invention. Figure 2A draw figure 1 A three-dimensional schematic diagram of the hook of the rotatable stopper not located in the slot of the second support block. Figure 2B draw figure 1 The three-dimensional partial schematic diagram of the rod part of the rotatable stopper not being buckled on the fastening part of the top plate. Figure 2C draw figure 1 A three-dimensional schematic diagram of the hook of the rotatable stopper being located in the slot of the second support block. For the sake of illustration, figure 1 Some components are omitted from illustration. Please refer to figure 1 , in this embodiment, the temporary wafer storage cassette 100 a includes a top plate 110 , a bottom plate 120 , a plurality of side plates 130 a , 130 b , 130 c and a rotatable stopper 140 .

[0061] For details, please also refer to Figu...

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PUM

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Abstract

A wafer temporary storage clamping case comprises a top plate, a bottom plate, multiple side plates and a rotary backstop member. The top plate has a clamping portion. The bottom plate and the top plate are disposed in parallel. The bottom plate has multiple supporting blocks, at least one of the supporting blocks having a clamping groove. The top plate, the bottom plate and the side plates form accommodation space and define a pick and place opening. Surfaces of the side plates facing the accommodation space respectively have multiple first fixing grooves for inserting multiple wafers in different layers. The rotary backstop member has a rod portion and a clamping hook which is fixed on a bottom end of the rod portion. When a top end of the rod portion is clamped to the clamping portion, the clamping hook is not positioned in the clamping groove, and the rod portion limits the horizontal displacement of the wafers. When the top end of the rod portion is not clamped with the clamping portion, the clamping hook motions at the same time and is positioned in the clamping groove, and thus the wafers can be took out from the pick and place opening.

Description

technical field [0001] The present invention relates to a temporary storage cassette, and in particular to a wafer temporary storage cassette. Background technique [0002] Semiconductor wafers will be transported to different workstations due to the need to go through various processes and to cooperate with process equipment. In order to facilitate the handling of wafers and avoid impacts from external forces, multiple wafers are stored in temporary wafer storage cassettes. [0003] Generally speaking, a plurality of slots arranged layer by layer are arranged in the temporary wafer storage cassette to accommodate a plurality of wafers horizontally, and one side of the cassette has an opening for loading and unloading of the wafers. Furthermore, a stop member is also provided at the opening to prevent the wafer from slipping out during transport. However, when transporting the temporary wafer storage cassette storing the wafers to the next workstation, the operator often f...

Claims

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Application Information

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IPC IPC(8): H01L21/673
Inventor 唐英泰
Owner CHIPMOS TECH INC
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