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Single Chip Back Metal Process Fixture

A backside metal, single-chip technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of poor backside metal quality and low yield, and achieve the effect of improving purity and reducing scratches

Active Publication Date: 2016-04-13
NO 24 RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of low yield and poor quality of the back metal in the back metal process, the present invention proposes a single-chip back metal process fixture

Method used

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  • Single Chip Back Metal Process Fixture
  • Single Chip Back Metal Process Fixture
  • Single Chip Back Metal Process Fixture

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Experimental program
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Embodiment Construction

[0030] The present invention will be described in further detail below in conjunction with specific embodiments and accompanying drawings.

[0031] A backside metal craft fixture of the present invention includes: a disc support base (1), a U-shaped positioning frame (2), a fixing rivet (3), a fixing pressure block (4), and a locking screw (5) , silicon gasket (6), silicon fixed bar (7) and other seven parts.

[0032] figure 1 It is a schematic diagram of the three-dimensional structure of the chip back gold fixture of the present invention; figure 2 It is a schematic diagram of the overall structure of the chip back gold jig of the present invention, which is a back metal process jig formed by refitting a general-purpose wafer carrier base (1); image 3 It is a schematic diagram of the connection between the wafer carrier base (1) and the U-shaped positioning frame (2) of the present invention.

[0033] Figure 1-3 Among them, the circular bearing base (1) and the U-shap...

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PUM

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Abstract

The invention relates to a single-chip back side metal craft fixture which comprises seven parts including a wafer bearing sheet base, a U-shaped positioning frame, a fixed pressing sheet, a silicon fixed baffle bar and a silicon gasket and the like. According to the fixture provided by the invention, because adhesive residue does not exist, the scraping of a chip is reduced; the metal purity at the back side of the chip is improved, so the yield of finished products of the metal craft on the back side of the chip is improved; and the yield of IC (integrated circuit) finished products is improved to 90% from 20%. The fixture can be widely applied to the field of single-chip back side metal crafts during the manufacturing process of semiconductor integrated circuits.

Description

technical field [0001] The invention relates to a single-chip back metal process fixture, which is suitable for the single-chip back metallization process field in the semiconductor integrated circuit manufacturing process. Background technique [0002] In the manufacturing process of semiconductor integrated circuits, the back metal process has always been one of the key processes to improve the quality of IC packaging and improve the reliability of IC final products. With the maturity of the IC standard FOUNDRY process, in order to save costs, the engineering batch processing methods of multi-chip processing (MPW) are increasing, and the phenomenon of providing users with a single chip is becoming more and more common. [0003] For this reason, it is necessary to carry out back metallization on the back of a single chip, which is convenient for packaging and adopts a sintering process to improve product reliability. For silicon chips using traditional processes, especiall...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687
Inventor 曹阳许小军周世远朱煜开张正元徐俊
Owner NO 24 RES INST OF CETC