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Method for manufacturing photoelectric circuit board

A technology for optoelectronic circuit boards and manufacturing methods, which is applied in the coupling of optical waveguides, printed circuit components, optical waveguides and light guides, etc., can solve the problems of slow process speed, low production efficiency, production of chemical waste liquid, etc., and achieves high process speed. , the effect of improving production efficiency

Inactive Publication Date: 2013-09-11
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the method of yellow light lithography is generally used to make the optical waveguide layer, but this not only slows down the process speed, but also lowers the production efficiency, and also requires the step of chemical development, so it will produce chemical waste liquid, which is easy to pollute the environment

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  • Method for manufacturing photoelectric circuit board
  • Method for manufacturing photoelectric circuit board

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Embodiment Construction

[0019] see figure 1 and figure 2 , a method for manufacturing a photoelectric circuit board 100 provided in an embodiment of the present invention, which includes the following steps:

[0020] S1: Provide a substrate 10 and clean the surface 101 of the substrate 10 . The substrate 10 can be a flexible substrate or a rigid substrate. The substrate 10 already has a conductive circuit layout (not shown), and the conductive circuit may be a metal circuit or a circuit made of a transparent conductive compound. The metal circuit is gold wire, silver wire or copper wire. The transparent conductive compound is indium tin oxide.

[0021] S2: Form a layer of first cladding layer 20 on the surface 101 of the substrate 10 by spin coating. In this embodiment, a spin coating machine 200 is used to perform the spin coating process. The spin coater 200 includes a nozzle 201 and a turntable 202 . The substrate 10 is fixed on the turntable 202 and can rotate relative to the nozzle 201 ....

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Abstract

The invention relates to a method for manufacturing a photoelectric circuit board. The method includes the steps of providing a substrate with one surface, using a rotation coating method to form a first coating layer on the surface, solidifying the first coating layer, using a rotation coating method to form an inner core layer on the first coating layer, solidifying the inner core layer, using an idler wheel pressing method to form an optical waveguide pattern on the inner core layer, using a rotation coating method to form a second coating layer on the inner core layer, and solidifying the second coating layer. The method for manufacturing the photoelectric circuit board is high in manufacturing procedure speed and capable of effectively improving production efficiency.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing in semiconductor integrated circuit technology, in particular to a method for manufacturing an optical printed circuit board (OPCB). Background technique [0002] With the continuous development of the electronics industry, the signal transmission frequency and transmission rate continue to increase. Traditionally, metal wires transmit signals, but due to the physical characteristics of metal wires, problems such as LC delay and crosstalk will occur, and it has become increasingly difficult to meet the high-speed and high-frequency requirements of signals. Due to its large bandwidth and strong anti-interference ability, optical transmission has attracted more and more attention. Generally, optoelectronic circuit boards are used for light transmission. The optoelectronic circuit board includes an optical waveguide layer for transmitting optical signals. At present, the o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/13G02B6/42H05K1/02
Inventor 李秉衡
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD