A method for preparing a three-dimensional metamaterial sheet and a method for preparing a metamaterial
A technology of metamaterials and sheets, applied in the field of metamaterials
Active Publication Date: 2016-12-21
KUANG CHI INST OF ADVANCED TECH
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[0005] Most of the common "ten", "S", and "H" shaped metal microstructures are two-dimensional and can be realized by printing PCB boards. For the processing of three-dimensional metal microstructures, the processing of three-dimensional metamaterials There is currently no widely available method for preparing
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[0027] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0028] see figure 1 with figure 2 , which shows the state diagram of the preparation process of the three-dimensional metamaterial sheet and a metamaterial unit of the present invention, figure 2 The a-d in the middle are one-to-one correspondence figure 1 Changes in the preparation state in a-d.
[0029] see figure 1 in a and figure 2 In a, raw materials prepared for the preparation of the metamaterial sheet 1, the metamaterial sheet 1 includes a substrate 12, the metamaterial sheet is virtually divided into a plurality of metamaterial units 11, in order to facilitate the preparation of the metamaterial sheet 1, set Positioning hole 13 is provided.
[0030] see figure 1 middle b and figure 2 In middle b, first metal traces 111 and second metal traces 112 are respectively attached to the two surfaces of the substrate 12, and the met...
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The invention provides a method for preparing a three-dimensional metamaterial sheet layer and a metamaterial. The metamaterial sheet layer comprises a substrate and a plurality of metal microstructures. Each metal microstructure comprises a first metal routing line, a second metal routing line and a third metal routing line, wherein the first metal routing line and the second metal routing line are correspondingly arranged on two surfaces of the substrate and the third metal routing line penetrates through the substrate and is used for connecting the first metal routing line and the second metal routing line. The method includes the steps that the first metal routing lines and the second metal routing lines are correspondingly attached to the two surfaces of the substrate; through holes penetrating through the substrate are punched in the substrate, wherein the two ends of the through holes are located in the first routing lines and the second routing lines respectively; the through holes are metallized. The metamaterial can be prepared only by overlapping metamaterial sheet layers and spacer layers at intervals. The method for preparing the three-dimensional metamaterial sheet layer and the three-dimensional metamaterial only needs existing equipment, achieves mass production of the three-dimensional metamaterial and provides guarantees for further application of the three-dimensional metamaterial.
Description
technical field [0001] The invention relates to the field of metamaterials, in particular to a method for preparing three-dimensional metamaterial sheets and metamaterials composed of three-dimensional metamaterial sheets. Background technique [0002] With the rapid development of high-tech such as radar detection, satellite communication, and aerospace, as well as the rise of research fields such as anti-electromagnetic interference, stealth technology, and microwave anechoic chambers, research on microwave-absorbing materials has attracted more and more attention. Metamaterials can have very wonderful electromagnetic effects, and can be used in the fields of wave-absorbing materials and invisible materials, and have become a research hotspot in the field of wave-absorbing materials. [0003] The properties and functions of metamaterials mainly come from the metal structures with periodic arrangement inside them. How to precisely prepare fine metal structures becomes the k...
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IPC IPC(8): H01Q15/00
Inventor 刘若鹏徐冠雄金曦王文剑
Owner KUANG CHI INST OF ADVANCED TECH