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A printed circuit board and its manufacturing method

A printed circuit board and manufacturing method technology, which is applied in the directions of printed circuit components, electrical connection formation of printed components, and electrical connection of printed components, etc., can solve the problem of rising manufacturing costs, reduced layout density of printed circuit boards, and back-drilling peripheral substrates. Drilling down etc.

Active Publication Date: 2016-05-25
XFUSION DIGITAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at the same time as the hole pad is removed from the PCB, the surrounding substrate of the backdrilled hole is also drilled away
This requires the back drilling space to be reserved in advance when designing the layout, which leads to a decrease in the layout density of the printed circuit board and an increase in the production cost

Method used

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  • A printed circuit board and its manufacturing method
  • A printed circuit board and its manufacturing method
  • A printed circuit board and its manufacturing method

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0023] See figure 1 , a flowchart of a method for manufacturing a printed circuit board provided in a preferred embodiment of the present invention; the method may include the following steps:

[0024] Step 101, providing a copper-clad substrate, wherein the copper-clad substrate includes several inner layers stacked in sequence, via holes penetrating through the inner layers, and a first copper cladding layer plated on the top surface of the inner layers, wherein ...

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PUM

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Abstract

The invention provides a printed circuit board comprising a plurality of inner layers sequentially overlapped, first surface layers arranged at the tops of the inner layers and via holes penetrating the inner layers. Copper walls are arranged in the via holes, first through grooves are formed in the first surface layers, the first through grooves correspond to and are communicated with the via holes, and first end portions of the copper walls form first preset distances with the top surfaces of the inner layers so as to break electric connection of the copper walls of the via holes with the first surface layers. With the printed circuit board, users' special requirements on the printed circuit board can be met, and further density of overall arrangement of the printed circuit board is increased. The invention further provides a production method of the printed circuit board.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a printed circuit board and a manufacturing method thereof. Background technique [0002] The via hole on the printed circuit board is to realize the conduction between different inner layers of the printed circuit board. In a conventional design of a printed circuit board, the upper and lower surface layers of the printed circuit board are provided with hole plates to electrically connect the inner layer with the upper and lower surface layers. When the user has special requirements for the printed circuit board, such as the user requires no electrical connection between the inner layer of the printed circuit board and the upper and lower surface layers, the hole plate needs to be removed. The industry generally adopts mechanical back drilling to remove the orifice plate. The so-called mechanical back drilling is to use a special drilling equipment with depth control abili...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/42
Inventor 李继厚黄明利付文豪
Owner XFUSION DIGITAL TECH CO LTD