Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of manufacturing method of pcb board

A manufacturing method and PCB board technology, applied in the direction of cleaning/polishing of conductive patterns, secondary treatment of printed circuits, etc., can solve problems such as scratches or pits on the surface of PCB boards, short process flow, long operating time, etc., to avoid Scratch, oxidation reaction time is short, and the effect of reducing environmental damage

Inactive Publication Date: 2016-03-09
GUANGDONG SHENGYI SCI TECH
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These physical cleaning methods, the designed cleaning device has a simple structure, a short process flow, and the cleaning efficiency is also improved to a certain extent, but these methods can neither completely eliminate the residue of glue traces or particles, and may also damage the PCB board There are scratches or pits on the surface, which will cause a certain degree of damage to the surface of the board, and the above treatment methods are cumbersome to operate and take a long time to operate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of manufacturing method of pcb board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for making a PCB board, comprising material cutting, chemical cleaning process and follow-up process, wherein the chemical cleaning process steps are as follows:

[0026] On the upper plate, the cut substrate is transferred and placed on the waiting platform of the cleaning device, which is convenient for picking up in the subsequent cleaning steps;

[0027] For degumming, transfer the substrate on the platform to be treated to a degumming tank equipped with an alkaline sodium permanganate solution, and rinse for 5 seconds. In the degumming tank, the solution temperature is 80°C, and the concentration of sodium permanganate is 60g / L, the addition amount is 8mL / m 2 , the concentration of sodium hydroxide is 40g / L, and the addition amount is 18mL / m 2 ,The PCB or CCL board is rinsed in the glue removal tank for 10 seconds, and the liquid level of the glue removal tank is 170mm.

[0028] Washing with water, rinsing the glue-removed substrate with clean water for ...

Embodiment 2

[0030] A method for manufacturing a PCB board, comprising cutting, chemical cleaning process, grinding plate process and follow-up process in sequence, wherein the chemical cleaning process steps are as follows:

[0031] On the upper plate, the cut substrate is transferred and placed on the waiting platform of the cleaning device, which is convenient for picking up in the subsequent cleaning steps;

[0032] For degumming, transfer the substrate on the platform to be treated to a degumming tank equipped with an alkaline sodium permanganate solution, and rinse for 10 seconds. In the degumming tank, the solution temperature is 77°C, and the concentration of sodium permanganate is 65g / L, the addition amount is 8mL / m 2 , the concentration of sodium hydroxide is 40g / L, and the addition amount is 18mL / m 2 ,The PCB or CCL board is rinsed in the glue removal tank for 10 seconds, and the liquid level of the glue removal tank is 170mm.

[0033] Washing with water: Rinse the glue-remove...

Embodiment 3

[0035] A method for manufacturing a PCB board, comprising cutting, chemical cleaning process, grinding plate process and follow-up process in sequence, wherein the chemical cleaning process steps are as follows:

[0036] On the upper plate, the cut substrate is transferred and placed on the waiting platform of the cleaning device to facilitate the picking up of the subsequent cleaning steps;

[0037]For degumming, transfer the substrate on the platform to be treated to a degumming tank equipped with an alkaline sodium permanganate solution, and rinse for 3 seconds. In the degumming tank, the solution temperature is 83°C, and the concentration of sodium permanganate is 70g / L, the addition amount is 8mL / m 2 , the concentration of sodium hydroxide is 35g / L, and the addition amount is 23.4mL / m 2 ,The PCB or CCL board is rinsed in the glue removal tank for 5 seconds, and the liquid level of the glue removal tank is 175mm.

[0038] Washing with water: Rinse the glue-removed substr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of PCB (printed circuit board) production, in particular to a method for manufacturing a PCB (printed circuit board). The method for manufacturing the PCB includes a preprocessing procedure for cutting a board, removing pollutants on copper surfaces and improving the roughness of each copper surface, and a follow-up procedure. A chemical cleaning procedure is carried out in the preprocessing procedure. The method has the advantages that adhesive particles and / or adhesive marks on the board surfaces of the PCB are cleaned in the chemical cleaning procedure, increase of the PCB manufacturing cost is prevented, the cleanliness of the PCB is improved, the reject ratio of the PCB is reduced, particularly, damage to the appearance of the board in the cleaning procedure is reduced, and the integral PCB manufacturing efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of PCB or CCL production, in particular to a method for manufacturing a PCB. Background technique [0002] Copper Clad Laminate, also known as Copper Clad Laminate (abbreviated as CCL), is the basic material of the electronics industry. It consists of a dielectric layer (resin resin, glass fiber Glassfiber) and a high-purity conductor (copper foil Copperfoil). The composite material formed can form conductive patterns on it; CCL board is one of the indispensable raw materials for PCB board manufacturing. [0003] In the process of PCB board production, the copper clad laminate must first be cut, that is, the copper clad laminate should be sheared. Due to processing reasons such as operation and shearing, it is easy for resin dust particles or glue traces to remain on the board surface. Therefore, In the production of PCB boards, it is necessary to pre-treat the PCB boards to eliminate factors that affect th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/26
Inventor 曾梅燕
Owner GUANGDONG SHENGYI SCI TECH