Method and device for preparing solder joints for chip-level devices

Abstract

The invention discloses a method and device for manufacturing welding points of a chip-level device. The device comprises a solution container, a flow distributor, a device fixing plate and a tube core mould. The solution container is used for providing welding solutions, a plurality of nozzles arranged in an array mode are arranged on the flow distributor, the flow distributor is communicated with the solution container, and the welding solutions are sprayed out through the nozzles. The device fixing plate is fixedly arranged below the nozzles through a base plate, devices with welding points to be manufactured are horizontally laid on the device fixing plate, the device fixing plate is connected with the nozzles through a high pressure generator, and a high voltage electric field is formed between the device fixing plate and the nozzles. The tube core mould comprises a plurality of tube cores arranged in an array mode, the tube cores are correspondingly inserted into the nozzles in a one-to one mode, spaces containing the welding solutions is formed in the clearances between the nozzles and the tube cores, and under the action of the electric field, after flow distribution is carried out on the welding solutions in the spaces of the nozzles, the welding solutions are sprayed out to form spraying points or spraying threads and drop on the surfaces of the devices to form the welding points. The welding points with micron-order sizes can be manufactured on the chip-level device, the resolution ratio is 1-2 magnitude orders higher than that of a traditional jet printing method, and the method and device is suitable for the solutions with high viscosity.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and in particular relates to a method and device for preparing solder joints of chip-level devices. Background technique [0002] With the development of electronic products in the direction of lightness, thinness, shortness, smallness and multiple functions, it is required that the packaging density of electronic chips should be high, have good electrical and thermal performance, good reliability and low cost. In order to facilitate connection, general chip-level devices use solder joints to achieve electrical connection. The quality of solder joints directly affects the electrical performance of the device, and with the miniaturization of electronic devices, the size of solder joints is also developing towards miniaturization. [0003] At present, the existing solder joint production methods include evaporation deposition, printing, electroplating, microsphere method, sticky point ...

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Problems solved by technology

[0006] Aiming at the problems or improvement needs in the prior art, the present invention provides a method and device for preparing solder joints of chip-level devices. Solve the existing problems of uneven solder distribution in solder joints and low precision of solder joints that affect the electrical performance of devices

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