Vibrator element, vibration device and electronic apparatus
A technology for electronic equipment and vibration devices, applied to measuring devices, gyroscopes/steering sensing devices, circuits, etc., can solve problems such as not necessarily high adhesion, peeling of the upper electrode layer, and reduced reliability
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no. 1 approach
[0070] First, the first embodiment of the present invention will be described.
[0071] figure 1 Is a schematic cross-sectional view showing the schematic structure of the sensor device (vibration device) according to the first embodiment of the present invention, figure 2 for, figure 1 The top view of the sensor device shown, image 3 for, figure 1 A plan view of the sensor element (vibration plate) included in the sensor device shown, Figure 4 for, image 3 A-A line cross-sectional view in Figure 5 (a) is, image 3 Sectional view of line B-B in, Figure 5 (b) is, image 3 Sectional view of line C-C in.
[0072] In addition, in the following, for convenience of explanation, Figure 1 ~ Figure 5 In the figure, the x-axis, y-axis, and z-axis are shown as three axes orthogonal to each other, and the tip side of the arrow mark in the figure is set to "+ side" and the base end side is set to "- side" . In addition, the direction parallel to the x-axis is called the "x-axis direction...
no. 2 approach
[0236] Next, a second embodiment of the present invention will be described.
[0237] Figure 8 It is a diagram for explaining the sensor element (vibrating element) according to the second embodiment of the present invention.
[0238] The sensor element according to this embodiment is the same as the sensor element according to the first embodiment described above, except for the difference in the configuration related to the wiring of the drive unit and the detection unit.
[0239] In addition, in the following description, regarding the sensor element of the second embodiment, the difference from the embodiment described above will be mainly described, and the description of the same matters will be omitted. In addition, in Figure 8 Here, the same symbols are attached to the same structures as in the above-mentioned embodiment. In addition, Figure 8 (a) is, and Figure 5 (a) The corresponding cross-sectional view, Figure 8 (b) is, and Figure 5 (b) Corresponding sectional view...
no. 3 approach
[0253] Next, a third embodiment of the present invention will be described.
[0254] Picture 9 It is a diagram for explaining the sensor element (vibrating element) according to the third embodiment of the present invention.
[0255] The sensor element according to this embodiment is the same as the sensor element according to the first embodiment described above, except for the difference in the configuration related to the wiring of the drive unit and the detection unit.
[0256] In addition, in the following description, regarding the sensor element of the third embodiment, the difference from the above-mentioned embodiment will be mainly described, and the description of the same matters will be omitted. In addition, in Picture 9 Here, the same symbols are attached to the same structures as in the above-mentioned embodiment. In addition, Picture 9 (a) is, and Figure 5 (a) The corresponding cross-sectional view, Picture 9 (b) is, and Figure 5 (b) Corresponding sectional vie...
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