Light-Emitting Diode (LED) packaging method
A technology for light-emitting diodes and packaging methods, which is applied to electrical components, electrical solid-state devices, circuits, etc., can solve the problems affecting the yield of the light-emitting diode process, and achieve the advantages of enhancing scattering, improving the process yield, and reducing the probability of total reflection. Effect
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[0011] The packaging method of the light emitting diode 100 of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0012] Step 1: See first figure 1 , a substrate 10 is provided, and the substrate 10 includes a first surface 11 and a second surface 12 opposite to the first surface 11 . The first surface 11 of the substrate 10 forms a pin structure 20, and the pin structure 20 includes a first electrode 21 and a second electrode 22 separated from each other, and each electrode 21, 22 is formed from the first electrode 21 of the substrate 10. The surface 11 extends to this second surface 12 .
[0013] A reflection cup 30 is also formed on the first surface 11 of the substrate 10. The reflection cup 30 includes an upper surface 31 and a lower surface 32. The surface of the reflection cup 30 can be formed with a highly reflective material. The reflection cup 30 and the guide The pin structure 20 and the substrate firs...
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