Light-Emitting Diode (LED) packaging method

A technology for light-emitting diodes and packaging methods, which is applied to electrical components, electrical solid-state devices, circuits, etc., can solve the problems affecting the yield of the light-emitting diode process, and achieve the advantages of enhancing scattering, improving the process yield, and reducing the probability of total reflection. Effect

Inactive Publication Date: 2013-10-23
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The encapsulation layer is usually formed by injection or pouring. During the encapsulation process, it is easy to overflo

Method used

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  • Light-Emitting Diode (LED) packaging method
  • Light-Emitting Diode (LED) packaging method
  • Light-Emitting Diode (LED) packaging method

Examples

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Embodiment Construction

[0011] The packaging method of the light emitting diode 100 of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0012] Step 1: See first figure 1 , a substrate 10 is provided, and the substrate 10 includes a first surface 11 and a second surface 12 opposite to the first surface 11 . The first surface 11 of the substrate 10 forms a pin structure 20, and the pin structure 20 includes a first electrode 21 and a second electrode 22 separated from each other, and each electrode 21, 22 is formed from the first electrode 21 of the substrate 10. The surface 11 extends to this second surface 12 .

[0013] A reflection cup 30 is also formed on the first surface 11 of the substrate 10. The reflection cup 30 includes an upper surface 31 and a lower surface 32. The surface of the reflection cup 30 can be formed with a highly reflective material. The reflection cup 30 and the guide The pin structure 20 and the substrate firs...

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Abstract

An LED packaging method comprises the steps that a pin structure and a reflector cup are formed on a provided substrate, the pin structure comprises a first electrode and a second electrode separated from the first electrode, and a recess is enclosed by the reflector cup, the pin structure and the substrate; a light emitting element is arranged on the pin structure in the recess, and electrically connected to the first and second electrodes; a packaging layer is formed in the recess to cover the light emitting element; and the packing layer and the upper surface of the reflector cup are processed by a sandblast technology. Compared with the prior art, the packaging layer is processed by the sandblast technology in the packing method, so that burr structure is removed while the surface of the packaging layer is processed into a rough accidented surface with trickle projections due to impact and cutting effects of the spraying material, thereby effectively improving yield rate of LED production, enhancing scattering of emitted lights, reducing occurrence rate of total reflection, and improving light extraction efficiency of an LED.

Description

technical field [0001] The invention relates to a semiconductor packaging method, in particular to a light emitting diode packaging method. Background technique [0002] Light Emitting Diode (LED) is a semiconductor element that can convert current into light in a specific wavelength range. With its advantages of high luminous efficiency, small size, light weight, and environmental protection, it has been widely used in current in various fields. [0003] The LED packaging structure generally includes a base, two electrodes combined with the base, an LED chip fixed in a reflective cup of the base and connected to the two electrodes, and a packaging layer for encapsulating the LED chip. The packaging layer of the light emitting diode is formed in the reflective cup and is flush with the upper surface of the reflective cup. The encapsulation layer is usually formed by injection or pouring. During the encapsulation process, it is easy to overflow or flow out from the reflecti...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/62H01L33/60
CPCH01L2224/48227H01L2924/1815
Inventor 林新强陈滨全
Owner ZHANJING TECH SHENZHEN
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