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Heat source module

A heat source and power supply technology, applied in the direction of adjusting electric variables, control/regulation systems, instruments, etc., can solve problems such as heat source device failure, function failure, chip failure, etc., to improve service life, reduce component failure probability, and reduce power consumption. The effect of the probability of migration

Active Publication Date: 2015-03-18
MEMSIC SEMICON WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, an unavoidable problem arises
That is, the unidirectional working current is likely to cause electromigration, and then cause the failure of the heat source device
In this way, since the heat source module is a necessary working module, its function failure will also lead to the failure of the entire chip

Method used

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  • Heat source module

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Embodiment Construction

[0018] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0019] see figure 1 As shown, one embodiment of the present invention discloses a heat source module, which includes a circuit 10 , a DC power supply element VDD13 , a ground element GND14 and a resistance wire 15 connected in the circuit.

[0020] The circuit 10 includes a first branch 11 and a second branch 12 , and the two branches share a resistance wire 15 . As shown in the figure, in the two branches, the direction of the current flowing through the resistance wire is opposite. And in each branch, located at the two ends of the resistance wire, switches 112, 114, 122, 124 and switch circuits are respectively provided, for example, one of P-mos switch circuit and N-mos switch circuit, used to control In the branch circuit, the switch is turned on or off. Moreover, a non-overlapping pulse circuit is also provided in the circuit for cont...

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Abstract

The invention relates to a heat source module which comprises a circuit and a heat source device connected in the circuit. The circuit comprises a first branch and a second branch which share the heat source device. When the first branch and the second branch are electrified, directions of currents, in the first branch and the second branch, passing the heat source device, are opposite, and the first branch and the second branch cannot be in connection states at the same time. Consequently, direction turning of currents of the heat source device can be realized according to setting, so that probability of electromigration is lowered, and effectiveness of the heat source module is improved.

Description

technical field [0001] The invention relates to electronic components in the field of electronic components, in particular, a heat source module component. Background technique [0002] With the rapid development of electronic product technology, its application range is becoming wider and wider. For electronic chips used in some fields, the heat source module is a necessary component module and plays a specific heat source function. [0003] As far as the design of the heat source module currently used in the industry is concerned, it is usually directly powered by the power supply element, and the current passes through the heat source device, and then makes it energized to generate heat. Due to the design setting, the direction of the current passing through the heat source device is always in one direction. In this way, it will lead to an inevitable problem. That is, the unidirectional working current is likely to cause electromigration, and then cause the failure of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05F1/46
Inventor 金羊华蒋乐跃蔡永耀刘海东亚历克斯德罗宾斯基格雷格普希
Owner MEMSIC SEMICON WUXI