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Apparatus and method for cleaning substrates

A technology for cleaning devices and substrates, applied to liquid cleaning methods, cleaning methods and utensils, chemical instruments and methods, etc., capable of solving problems such as reduced efficiency

Inactive Publication Date: 2013-10-30
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Substrate handling process is reduced in efficiency due to tilting phenomenon

Method used

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  • Apparatus and method for cleaning substrates
  • Apparatus and method for cleaning substrates
  • Apparatus and method for cleaning substrates

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Embodiment Construction

[0044] Preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the thickness of layers and regions are exaggerated for clarity.

[0045] image 3 is a plan view of a substrate processing apparatus according to an embodiment of the present invention.

[0046] refer to image 3, the substrate processing apparatus 1 a includes an indexer module 10 and a process processing module 20 . The indexer module 10 includes a loading aperture 120 and a transfer frame 140 . The loading hole 120, the transfer frame 140, and the process treatment module 20 are sequentially arranged on a straight ...

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Abstract

The substrate cleaning apparatus includes a first process chamber in which a liquid treating process is performed on a substrate by supplying a treating solution, a second process chamber in which a drying process is performed on the substrate, and a carrying unit carrying the substrate between the first process chamber and the second process chamber. The first process chamber includes a liquid treating housing providing a space in which the liquid treating process is performed on the substrate, a spin chuck supporting the substrate within the liquid treating housing, and a liquid supply member supplying the treating solution onto the substrate supported by the spin chuck. The second process chamber includes a drying housing providing a space in which the substrate is dried, a substrate support member supporting the substrate within the drying housing, and a heater heating the substrate.

Description

technical field [0001] The present invention disclosed herein relates to an apparatus and method for manufacturing a semiconductor substrate, and more particularly, to an apparatus and method for cleaning a substrate. Background technique [0002] Generally, semiconductor devices are manufactured by performing various processes such as photographic processing, etching processing, ion implantation processing, and deposition processing on a substrate such as a wafer. [0003] Furthermore, while each process is performed, a cleaning process for removing various contaminants attached to the substrate is performed. The cleaning process includes: a chemical process for removing contaminants attached to the substrate by using chemicals; a wet cleaning process for removing chemicals remaining on the substrate by using purified water; A drying process that removes purified water remaining on the surface of the substrate. [0004] Among them, the drying process is performed by suppl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/67028B08B3/10H01L21/67051
Inventor 金裕桓姜秉万吴世勋金娟準
Owner SEMES CO LTD