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A resin composition and a prepreg and a semi-flexible copper clad laminate using the combination

A resin composition and the technology of the composition, which are applied in the field of copper clad laminates, can solve the problems such as the decrease of the glass transition temperature heat resistance index and the large negative influence of the rubber heat resistance.

Active Publication Date: 2015-08-19
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the commonly used method of toughening epoxy resin is to add rubber. Although it can improve the flexibility of the system, the rubber has too much negative impact on the heat resistance, which makes the glass transition temperature (Tg) and other heat resistance indicators of the system decrease. too much

Method used

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  • A resin composition and a prepreg and a semi-flexible copper clad laminate using the combination
  • A resin composition and a prepreg and a semi-flexible copper clad laminate using the combination
  • A resin composition and a prepreg and a semi-flexible copper clad laminate using the combination

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The resin composition for making semi-flexible copper-clad laminates, a total of 100 parts (by weight) of the resin composition includes: 70 parts of brominated bisphenol A epoxy resin (Dow Chemical, DER530), amine-terminated Base polyurethane (self-made) 30 parts.

[0032] The amino-terminated polyurethane is self-made, and its preparation method includes two steps of prepolymer synthesis and terminal amination reaction, specifically:

[0033] Prepolymer synthesis: Add the dehydrated polyether into the four-necked flask, connect the nitrogen device, add the measured TDI in the temperature range of 30-40°C, control the reaction temperature at 70°C, and react for 3 hours When the test NCO% reaches the theoretical value, the reaction is stopped, and the polyurethane prepolymer with terminal isocyanate group is obtained;

[0034] Terminated amination reaction: first add the measured amine into the four-necked flask, and add acetone solvent to dilute, then add the synthesi...

Embodiment 2

[0036] The resin composition used to make semi-flexible copper clad laminates, a total of 100 parts (by weight) of the resin composition includes: 40 parts of isocyanate modified epoxy resin (Dow Chemical, DER593), amine-terminated polyurethane ( Homemade) 60 servings.

[0037] The preparation method of amino-terminated polyurethane is the same as that of specific example 1.

Embodiment 3

[0039] The resin composition used to make semi-flexible copper clad laminates, a total of 100 parts (by weight) of the resin composition includes: phosphorus-containing epoxy resin (Dow Chemical, XZ92530) 55 parts, amino-terminated polyurethane (self-made ) 45 copies.

[0040] The preparation method of amino-terminated polyurethane is the same as that of specific example 1.

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PUM

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Abstract

The invention relates to the technical field of copper clad plates, particularly to a resin composition and a prepreg and a semi-flexible copper clad plate utilizing same. The resin composition comprises, by weight, 40 to 70 parts of epoxy resin and 30 to 60 parts of amino-terminated polyurethane. The epoxy resin and the amino-terminated polyurethane are directly mixed under a certain stirring speed to obtain the resin composition. The resin composition has excellent flexibility as a curing system of the semi-flexible copper clad plate, so that the semi-flexible copper clad plate which is formed by the resin composition has excellent flexure performance in comparison with the ordinary epoxy glass fabric substrate.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a resin composition and a prepreg and semi-flexible copper-clad laminate using the combination. Background technique [0002] The miniaturization and multi-functionalization of electronic products, especially the miniaturization and high performance of consumer electronics products have become an obvious trend, which requires printed circuit boards (PCBs) to achieve high density and high performance. Under this premise, flexible boards and rigid-flexible boards have shown advantages. These special-structure PCB boards can significantly reduce the volume occupied by electronic products and achieve dense assembly and three-dimensional assembly. [0003] At present, the reinforcing material used in flexible copper clad laminates (FCCL) is polyimide film (PI) film, and the reinforcing material used in the flexible part of rigid-flexible boards is also PI film. PI film ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/02C08L75/08C08G18/48C08G18/10C08G18/30
Inventor 汪青
Owner GUANGDONG SHENGYI SCI TECH
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