A printed circuit board elastic pad with a vertical support structure

Abstract

The invention discloses a printed circuit board elastic bonding pad having a vertical supporting structure. The printed circuit board elastic bonding pad comprises an insulation layer and a base, wherein the insulation layer is arranged above the base, a bonding pad is arranged on the top of the central position of the insulation layer, a through hole is arranged in the insulation layer below the bonding pad, two inner sides of the through hole are respectively provided with a triangular reinforcing rib, the inner side of each triangular reinforcing rib is provided with a conductive layer, a fixed base is arranged on the bottom of a closed chamber formed by encircling the conductive layer, and three vertical supporting plates are arranged between the position above the fixed base and the bonding pad. The printed circuit board elastic bonding pad has the beneficial effects that the reliability in machining can be realized, and the pseudo soldering caused by the outofflatness and collapse of the bonding pad can be avoided, so that the reliability in electric connection of a printed circuit board can be improved; the structure of the bonding pad can be reinforced by adding the triangular reinforcing ribs; and the supporting force can be provided for the bonding pad from bottom to top for a long time.

Description

technical field [0001] The invention relates to the field of printing technology, in particular to an elastic pad of a printed circuit board with a vertical support structure. Background technique [0002] Printed circuit boards have developed from single-layer boards to double-sided boards, multi-layer boards, and flexible boards, and are constantly developing in the direction of high precision, high density, and high reliability, continuously reducing volume, reducing costs, and improving performance. The development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, thin wire, small pitch, high reliability, multi-layer, high-speed transmission, light weight and thin shape in terms of performance. The wires of the single-sided panel only appear on one side, and the double-sided panel is an extension of the single-sided panel, which can conduct the lines between the two layers through the vi...

AI Technical Summary

Problems solved by technology

At present, in common multi-layer printed circuit boards, there are usually pads, circuit layers and insulating layers from top to bottom, wherein the pads are located on the upper surface of the circuit layer, and the insulating layer is formed with through holes. Sometimes, the position of the pads It will correspond to the position of the through hole, and part or all of it will fall into the through hole. In this case, the processing of the pad will be unreliable, and it is easy to cause false soldering due to unevenness and collapse of the pad, resulting in electrical failure of the printed circuit board. Poor connection reliability; It should be pointed out that the support structure under the pad sometimes causes glue, ink, dust, etc. to enter it due to insufficient sealing, and it is not easy to clean

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