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Polysiloxane composition applicable to light-emitting diode components, base formulation and light-emitting diode components thereof

A technology of light-emitting diodes and polysiloxane, which is applied to electrical components, electrical solid devices, semiconductor devices, etc., and can solve problems such as cracking, unreliable bonding, and inconsistent shrinkage

Active Publication Date: 2016-01-20
CSI CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the previous material research and development is generally focused on the LED package, and there are few materials development for the base, base and / or lamp cup of the LED component.
However, since siloxane-based materials are often used in new materials for LED packages, it is usually difficult for siloxane-based materials to bond well with other materials
[0004] Moreover, since the package body and the base of the LED element are often made of different materials, their thermal shrinkage rates are quite different. Therefore, the existing base or lamp cup formulations are prone to poor adhesion or Inconsistent shrinkage leads to problems such as component detachment or cracking, which seriously affects the stability and service life of LED components

Method used

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  • Polysiloxane composition applicable to light-emitting diode components, base formulation and light-emitting diode components thereof
  • Polysiloxane composition applicable to light-emitting diode components, base formulation and light-emitting diode components thereof
  • Polysiloxane composition applicable to light-emitting diode components, base formulation and light-emitting diode components thereof

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment

[0043] The present invention will be illustrated by specific examples below, but the present invention is not limited. In the embodiment of the present invention, A represents alkenyl-containing cage, network or chain polysiloxane, B represents polysiloxane containing silicon-hydrogen bonds, and C represents polysiloxane containing thermal conductivity, flame retardancy, and aging resistance. It is a combination of fillers with various protective functions such as temperature resistance, and D represents a catalyst for olefinic hydrosilylation reaction.

[0044] In a specific embodiment of the present invention, B preferably represents cage, network or chain polysiloxane containing silicon-hydrogen bonds, but is not limited thereto.

[0045] Production of test samples

[0046] (1). Pour the prepared base or lamp cup formula material into the corresponding model, then heat until it is completely hardened, and take it out of the mold for use;

[0047] (2). Prepare the encapsul...

Embodiment 1）

[0076] Get (A) 88 grams of alkenyl-containing cage, network or chain polysiloxane;

[0077] (B) Silicon hydrogen group-containing polysiloxane is a silicon hydrogen group-containing cage, network or chain polysiloxane, and the silicon hydrogen group-containing cage, network or chain polysiloxane Silicone 10 grams;

[0078] (C) Containing 200 grams of high thermal conductivity materials, flame retardants, aging-resistant materials, anti-ultraviolet materials, high-temperature-resistant materials and various protective function fillers of the above-mentioned various combinations;

[0079] (D) Alkenyl-containing, hydrosilylation catalyst 50ppm.

[0080] Vacuum defoaming after thorough mixing to obtain the formula material for the base (base and / or lamp cup).

Embodiment 2 to 6）

[0082] The composition weight (grams) of the formula shown in Table 1, and vacuum defoaming after thorough mixing, to prepare the base (base and / or lamp cup) formulas of Examples 2 to 6.

[0083] (Table 1)

[0084]

[0085] The pedestal (base and / or lamp cup) formula obtained in the above-mentioned examples 1 to 6 was made into a sheet test sample, and compared with Comparative Example 1 (PPA lamp cup; polyphthalamide lamp cup) and 2 (Epoxy Lamp cups; epoxy resin lamp cups) are also subjected to the red ink test, reflow test, and cold and heat cycle test after high temperature and high humidity (-40°C / 120°C ), and the evaluation results are shown in Table 1.

[0086] As shown in Table 1, the pedestal (base or lamp cup) made of the thermoformable polysiloxane composition of the present invention is used in conjunction with the same type of encapsulant (encapsulation) in Examples 1 to 6, and the polysiloxane is used at the same time. Siloxane is the base material system and...

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Abstract

The invention relates to a polysiloxane composition which can be applied to a light emitting diode (LED) component. The polysiloxane composition comprises (A) cage, net or chain polysiloxane containing alkenyl, (B) polysiloxane containing a silicon-hydrogen bond, (C) a composition containing fillers with protection functions and (D) an alkene-hydrogen silylation reaction catalyst, wherein the composition containing fillers with protection functions can be selected from a material with high heat conductivity, a flame retardant, an anti-aging material, an ultraviolet-resistant material, a gas resisting material, a thermal expansion inhibitor and / or a high-temperature-resistant material. The polysiloxane composition can be used in a material formula of the base, lamp cup and / or packaging body of the LED component so as to effectively prolong the service life of the LED component and improve the stability of the LED component.

Description

technical field [0001] The invention relates to a polysiloxane composition applicable to light-emitting diode elements, which can be applied to the material formulation of the base, lamp cup and / or packaging body of the light-emitting diode elements. Background technique [0002] In the development of light emitting diode (LED; light emitting diode), many industries or scholars have developed manufacturing materials that can effectively improve the stability or service life of LED components according to the material characteristics of LEDs. For example, Taiwan Patent No. I373478 "Curable Resin Composition, LED Packaging and Manufacturing Method, and Optical Semiconductor", U.S. Patent No. 7,615,387 "Addition curing silicone composition capable of producing acured product with excellent crack resistance" and U.S. Patent No. 7,705,104 "Addition curable silicon resin composition for light emitting diode". [0003] However, the previous material research and development is gene...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05H01L33/56
CPCH01L2224/48091H01L2224/48247H01L2924/181
Inventor 戈颂黄智伟
Owner CSI CHEM