A kind of LED encapsulation structure and LED encapsulation method
A technology of LED packaging and mounting holes, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of reducing light reflection rate, light output rate, light reflection rate attenuation, etc., and achieve the effect of enhancing light output effect and increasing light output rate
Active Publication Date: 2017-07-28
深圳市鼎华芯泰科技有限公司
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Problems solved by technology
[0004] Traditional LED packaging mainly includes bracket packaging and COB packaging. LEDs packaged with brackets are injected with PPA plastic reflective cups on silver-plated metal frames. The reflectivity of PPA plastic reflective cups can only reach 81%. The silver-plated layer on the brackets is used Oxidation and yellowing during the process will reduce the reflectivity and weaken the light output effect. LEDs soldered to the PCB will also reduce the light output rate due to their large thermal resistance; COB packaging also has the same problem of light reflectance attenuation, and there are serious boundary effects and The problem that the reflectivity of PCB surface is generally not high
Method used
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Embodiment 4
[0061] Embodiment 4 takes the installation hole 501 of the backing plate 5 and the through hole 301 on the reflective film 3 as a round hole, and one LED as an example to illustrate the flip-chip structure of the LED of the present invention. For the packaging of multiple LEDs, the technology in the art Personnel can fully consider adopting the long installation hole similar to embodiment 3 and the long through hole of reflective film to realize.
[0062] The packaging method of LED in Embodiment 5 of the present invention takes the LED light source module of Embodiment 1 as an example, and includes the following steps: (refer to Figure 1 to Figure 4 ,as well as Figure 12 to Figure 18 ,)
[0063] 1) The circuit 203 is etched out on the PCB board 2, and a hot-melt adhesive film is pasted on the back, such as Figure 12 shown.
[0064] 2) Punch out the installation hole 201 of the LED on the combination of the PCB board 2 and the thermosetting hot-melt adhesive film. The in...
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The invention discloses an LED packaging structure and an LED packaging method. The LED packaging structure includes at least one LED, a backing plate, a reflective film and a substrate, the backing plate is bonded above the substrate, the backing plate includes a mounting hole for the LED, the LED is located in the mounting hole and attached to the substrate, the reflective film Including a through hole, the through hole is smaller than the mounting hole of the backing plate; the plane part of the reflective film is bonded to the backing plate, and the part of the reflective film within the range of the mounting hole is concave to form a reflective slope of the LED, and the edge of the through hole of the reflective film Bonded to the substrate, the LEDs are located in the through-holes of the reflective film. The part of the reflective film of the LED packaging structure of the present invention is concave within the range of the installation hole to form a reflective slope of the LED, which improves the light output rate of the LED and enhances the light output effect of the LED light source module.
Description
[0001] [technical field] [0002] The invention relates to LED packaging, in particular to an LED packaging structure and an LED packaging method. [0003] [Background technique] [0004] Traditional LED packaging mainly includes bracket packaging and COB packaging. LEDs packaged with brackets are injected with PPA plastic reflective cups on silver-plated metal frames. The reflectivity of PPA plastic reflective cups can only reach 81%. The silver-plated layer on the brackets is used Oxidation and yellowing during the process will reduce the reflectivity and weaken the light output effect. LEDs soldered to the PCB will also reduce the light output rate due to their large thermal resistance; COB packaging also has the same problem of light reflectance attenuation, and there are serious boundary effects and The reflectivity of PCB surface is generally not high. [0005] [Content of the invention] [0006] The technical problem to be solved by the present invention is to provide ...
Claims
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IPC IPC(8): H01L33/60H01L33/48H01L25/075
CPCH01L2224/48091H01L2924/181
Inventor 何忠亮
Owner 深圳市鼎华芯泰科技有限公司