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Negative Photosensitive Resin Composition

A technology of photosensitive resin and composition, applied in the field of negative photosensitive resin composition and cured film, can solve the problem of use, can not be used as a permanent film, etc., and achieve the effect of high resolution

Active Publication Date: 2016-08-24
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this invention, the use of maleimide as alkali-soluble group is proposed, but it is positive and cannot be used as a permanent film

Method used

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  • Negative Photosensitive Resin Composition
  • Negative Photosensitive Resin Composition
  • Negative Photosensitive Resin Composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～7 and comparative example 1～4

[0164] According to the composition shown in Table 1 below, by mixing (B) component, (C) component and (D) solvent, further (E) component and (F) component in the solution of (A) component in a predetermined ratio, The negative photosensitive resin composition of each Example and each comparative example was prepared by stirring at room temperature for 3 hours to make a uniform solution.

[0165] [Table 1]

[0166]

[0167] About each negative photosensitive resin composition of the obtained Examples 1-7 and Comparative Examples 1-4, the viscosity of a solution, the film thickness after prebaking, a transmittance, a resolution, and a residual film rate were measured, respectively.

[0168] [Evaluation of viscosity]

[0169] The viscosity of the negative photosensitive resin composition was measured using an E-type rotational viscometer (spindle No. 1 (1°34')) at a rotation speed of 10 rpm and a temperature of 25°C.

[0170] [Evaluation of film thickness after prebaking] ...

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Abstract

The object of the present invention is to provide a solution that can be thickened even with a low-viscosity solution, has no stickiness before exposure, can form a pattern with high resolution by alkaline development, and provides a coating film with high transparency. Negative photosensitive resin composition with small post-baking shrinkage. It is related with the photosensitive resin composition containing following (A) component, (B) component, (C) component, (D) component as means for solving the subject of this invention. (A) component: an acrylic copolymer copolymerized from a monomer mixture containing at least (i) maleimide and (ii) a monomer having an epoxy group, (B) component: a photoacid generator, (C)component: the compound which has 2 or more epoxy groups, (D)component: solvent.

Description

technical field [0001] The present invention relates to a negative photosensitive resin composition and a cured film obtained from the negative photosensitive resin composition. More specifically, the present invention relates to a photosensitive resin composition suitable for use as a display material, a cured film thereof, and various materials using the cured film. Background technique [0002] It is known that an epoxy cationic polymerization-based UV curable resin containing an epoxy compound and a photoacid generator has high transparency and can be thickened (for example, Patent Document 1). However, since the coating film is sticky after coating and before exposure, workability is poor. Moreover, since image development cannot be performed with an alkaline aqueous solution, it is necessary to perform image development with an organic solvent. It can be considered that alkaline development can be achieved by introducing carboxyl groups into the polymer, but when mon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/038C08F220/32C08F222/40G03F7/004
CPCG03F7/038C08F220/325G03F7/0382G03F7/0388C08F220/32C08F222/40G03F7/0045
Inventor 畑中真服部隼人内山芽育
Owner NISSAN CHEM IND LTD