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Wave soldering carrier

A wave soldering and carrier technology, applied in the direction of manufacturing tools, welding equipment, auxiliary devices, etc., can solve problems such as poor soldering of electronic circuits

Inactive Publication Date: 2013-12-18
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of wave soldering, since the circuit board is only placed on the carrier board, when the solder in the tin bath is impacted by the tin wave, the circuit board will float due to the impact of the tin wave, resulting in poor soldering of the electronic circuit

Method used

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  • Wave soldering carrier

Examples

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Embodiment Construction

[0010] figure 1 It is a three-dimensional view of the wave soldering carrier 10 disclosed in the present invention. The wave soldering carrier 10 includes a substantially rectangular parallelepiped bottom plate 20 and a side wall 40 surrounding the edge of the bottom plate 20 . The base plate 20 is formed with an accommodating groove 22 matching the shape of the circuit board (not shown) and a plurality of through holes 24 communicating with the accommodating groove 22 . The accommodating groove 22 is used for placing circuit boards. The through hole 24 corresponds to the electronic circuit on the circuit board that needs wave soldering, so that the solder in the tin bath is soldered to the corresponding electronic circuit through the through hole 24 .

[0011] The bottom plate 20 is provided with a plurality of fixing components 26, which are used to fix the circuit board in the receiving groove 22, so as to prevent the circuit board from floating due to the impact of tin w...

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PUM

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Abstract

A wave soldering carrier comprises a bottom board. A containing groove and a plurality of through holes communicated with the containing groove are formed in the bottom board, the shape of the containing groove is matched with that of a circuit board and used for containing the circuit board, the through holes correspond to electronic circuits needing wave soldering on the circuit board, fixing components are arranged on the bottom board, each fixing component comprises a fixing part and a rotating part, each fixing part comprises a fixing shaft and a limiting shaft, each fixing shaft is fixed onto the bottom board, and each limiting shaft extends out from one end of the corresponding fixing shaft. The diameter of each limiting shaft is larger than that of each fixing shaft, so that a step is formed between each fixing shaft and the corresponding limiting shaft. The diameter of each rotating part is matched with each fixing shaft, and each rotating part is sleeved on the corresponding fixing shaft and contacts with the corresponding step. When each rotating part rotates around the corresponding fixing shaft to a preset position, the tail end of the rotating part contacts with the circuit board, so that the circuit board is fixed into the containing groove.

Description

technical field [0001] The invention relates to a wave soldering carrier. Background technique [0002] Generally, the carrier used in the wave soldering of the electronic circuit of the circuit board is a carrier plate that can carry the circuit board. The carrier plate is dragged on the minions on the opposite sides in the tin bath. Through holes so that the solder can be soldered to the electronic circuit through the through holes. However, in the process of wave soldering, since the circuit board is only placed on the carrier board, when the solder in the tin bath is impacted by the tin wave, the circuit board will float due to the impact of the tin wave, resulting in poor soldering of the electronic circuit . Contents of the invention [0003] In view of this, the present invention provides a wave soldering carrier that prevents the circuit board from floating due to the impact of tin waves. [0004] A wave soldering carrier, which includes a bottom plate, the bott...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00H05K3/34
CPCB23K3/087B23K3/00
Inventor 赵涛魏小丛曾威贤
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD