Unlock instant, AI-driven research and patent intelligence for your innovation.

Transparent substrate, as well as manufacturing method and application thereof

A technology of transparent substrates and manufacturing methods, applied to conductive layers, coatings, instruments, etc. on insulating carriers, can solve problems such as loss and light transmittance drop

Inactive Publication Date: 2013-12-18
NANCHANG O FILM TECH CO LTD +2
View PDF2 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditionally designed transparent substrates, when light passes through, due to the refraction and reflection of light, the light that finally passes through the transparent substrate will suffer a certain loss, especially when the surface of the substrate is coated with a conductive layer, the conductive material will make The transmittance of light further decreases

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Transparent substrate, as well as manufacturing method and application thereof
  • Transparent substrate, as well as manufacturing method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The transparent substrate, its preparation method, transparent conductive elements and thin film electronic devices containing the transparent substrate will be further described in detail below in conjunction with the accompanying drawings.

[0022] Such as figure 1 and figure 2 As shown, the transparent conductive element 100 according to one embodiment includes a transparent substrate 110 and a transparent conductive layer 120 . Wherein, the transparent substrate 110 includes a transparent substrate 112 and a porous silica composite coating 114 disposed on one side of the transparent substrate 112 . The transparent conductive layer 120 is disposed on the other surface of the transparent substrate 112 .

[0023] In this embodiment, the material of the transparent substrate 112 can be polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyethylene (PE), polycarbonate (PC), ring Olefin Copolymers (COC) or Cyclic Olefin Polymers (COP). The thickness o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
pore sizeaaaaaaaaaa
specific surface areaaaaaaaaaaa
Login to View More

Abstract

The invention relates to a transparent substrate. The transparent substrate comprises a transparent base and a porous silicon dioxide complex coating arranged on one side surface of the transparent base, wherein the porous silicon dioxide complex coating comprises nano-porous silicon dioxide and organic silicone resin filled in the nano-porous silicon dioxide, and the porosity of the porous silicon dioxide complex coating is 10%-50%. According to the transparent substrate, the porous silicon dioxide complex coating is arranged on one side surface of the transparent base, wherein the nano-porous silicon dioxide can be used for regulating pores of the complex coating, the effective refractive index of the coating can be further changed, the whole transparent substrate can obtain a better antireflection effect, and a permeability improvement effect of a product is further realized. In addition, the invention further relates to a manufacturing method of the transparent substrate as well as a transparent conducive element containing the transparent substrate and a thin film electronic device containing the transparent substrate.

Description

technical field [0001] The invention relates to the field of touch screen electronic devices, in particular to a transparent base material, a manufacturing method thereof, a transparent conductive element containing the transparent base material and a thin film electronic device. Background technique [0002] Transparent substrates such as optical glass, polyethylene terephthalate (PET), polymethyl methacrylate (PMMA) or films are widely used in the field of electronic displays. Traditionally designed transparent substrates, when light passes through, due to the refraction and reflection of light, the light that finally passes through the transparent substrate will suffer a certain loss, especially when the surface of the substrate is coated with a conductive layer, the conductive material will make The transmittance of light further decreases. With the development of touch screen electronic devices, users have higher and higher requirements for electronic equipment. Theref...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C08L67/02C08L33/12C08L23/06C08L69/00C08L45/00C09D183/06C09D7/12G06F3/041H01B5/14
Inventor 唐根初刘伟唐彬董绳财
Owner NANCHANG O FILM TECH CO LTD