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A kind of mask plate and preparation method thereof

A mask and film technology, applied in the field of photolithography, can solve problems such as mask pollution, and achieve the effect of reducing pollution and reducing possibility

Inactive Publication Date: 2017-01-18
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a mask and its preparation method to improve the problem that the mask is easily contaminated by organic solvents in the exposure process

Method used

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  • A kind of mask plate and preparation method thereof
  • A kind of mask plate and preparation method thereof
  • A kind of mask plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0047] Based on the same inventive concept, an embodiment of the present invention also provides a method for preparing a mask, including:

[0048] preparing the body of the mask;

[0049] A film layer containing oleophobic material that covers the surface of the body and can reduce the adhesion of organic condensation is formed on the body of the mask.

[0050] Compared with the traditional mask preparation method, the method for preparing the above-mentioned mask provided by the embodiment of the present invention adds a step of forming a film layer containing an oleophobic material on the body, because the organic condensation on the film layer The contact angle of the surface is relatively large, which can effectively reduce the possibility of organic condensation adhering to the surface of the mask, thereby alleviating the problem of contamination of the mask by the organic solvent in the photoresist during the exposure process.

[0051]Specifically, for the convenience ...

example 1

[0066] Perfluorododecyltrichlorosilane material is used as the oleophobic material contained in the film layer covering the body of the mask, and the preparation method of the mask is as follows Figure 4 As shown, it specifically includes the following steps:

[0067] S401. Prepare the body of the mask plate;

[0068] During specific implementation, this process step belongs to the prior art, and its specific preparation process will not be repeated here.

[0069] S402, using etching technology to etch the surface of the mask plate body;

[0070] In specific implementation, the inductively coupled plasma (ICP) etching technology of PlasmaPro TM System100ICP180 can be used to 2 ), oxygen (O 2 ) and helium (He) as etching gas to etch the surface of the body to increase the roughness of the surface of the body. Specifically, it is generally better to control the etching depth within 50nm.

[0071] S403, forming a cross-linked layer of silicone fiber material on the body;

...

example 2

[0079] Using fluorinated silicon dioxide nanoparticles as the oleophobic material covering the body of the mask, the preparation method of the mask is as follows Figure 5 As shown, it specifically includes the following steps:

[0080] S501, preparing the body of the mask plate;

[0081] During specific implementation, this process step belongs to the prior art, and its specific preparation process will not be repeated here.

[0082] S502, uniformly dispersing the fluorinated silica nanoparticles in an isopropanol (Iso Propyl Alcohol, IPA) solution;

[0083] S503. Spin coating an isopropanol solution in which fluorinated silicon dioxide nanoparticles are dispersed on the surface of the main body of the mask to obtain a film layer containing an oleophobic material covering the surface of the main body.

[0084] During specific implementation, the fluorinated silica nanoparticles used in step S502 can be prepared in the following manner:

[0085] First, add tetraethoxysilane...

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Abstract

A mask and a manufacturing method thereof are provided. The mask comprises a body and a film layer comprising an oleophobic material and covering the surface of the body, thereby the possibility of the organic coagulation adhering to the surface of the mask is effectively reduced, and the contamination of the mask by the organic solvent and other volatile organic in the photoresist during exposure is also reduced.

Description

technical field [0001] The invention relates to the technical field of photolithography technology, in particular to a mask plate and a preparation method thereof. Background technique [0002] In the existing photolithography process, especially in the photolithography process of proximity exposure, due to the reaction heat or photoexcitation in the exposure process, such as Figure 1a As shown, the residual organic solvent 2 in the photoresist 1 will volatilize to the mask 3, and condense and grow into an organic condensation 4 on the surface of the mask 3. The traditional mask 3 and the organic condensation 4 The contact angle θ is generally less than 90 degrees, such as Figure 1b As shown, the organic condensate has a greater wetting ability to the mask plate and is not easy to fall off. The organic condensate adhering to the surface of the mask will contaminate the surface of the mask, seriously affecting the exposure accuracy, and the contamination of the surface of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F1/48
CPCG03F1/48
Inventor 孙志义张然
Owner BOE TECH GRP CO LTD