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Laser cutting device

A laser cutting and lens technology, applied in the field of laser applications, can solve the problems of inconvenient changing of spot size, inaccurate adjustment of spot size, etc.

Active Publication Date: 2016-05-25
深圳市大族半导体装备科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in traditional laser cutting devices, the spot size of the laser beam with fixed power is fixed. If you need to change the spot size and shape of the laser, you need to move the laser or adjust the power of the laser.
Therefore, it is extremely inconvenient to change the spot size of the traditional laser cutting device, and the adjustment of the spot size is not accurate enough

Method used

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Embodiment Construction

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided for the purpose of making the disclosure of the present invention more thorough and comprehensive.

[0023] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly un...

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PUM

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Abstract

The invention discloses a laser cutting device. The laser cutting device comprises a bracket and two lenses which are slidably arranged on the bracket. An incident plane of each lens is an outwards-protruding cylindrical surface, so that the lenses have the collection effect on laser beams along the direction of alignments of the incident planes when the laser beams enter from an incident plane. The laser beams need to sequentially pass through the two lenses which are arranged in parallel and straight edge lines of the incident planes of the two lenses are vertical, so that the laser beams of the two lenses are compressed in the two vertical directions. The positions of the two lenses are changed to respectively adjust the compression degrees of the laser beams in the two vertical directions so as to adjust spot sizes of cutting points. According to the laser cutting device, the heights of the two lenses can be changed through sliding the lenses so as to realize the adjustment of the spot sizes; the distance changed by sliding the lenses is changed continuously and the smallest displacement can be realized accurately, so that the adjusting precision is improved greatly.

Description

technical field [0001] The invention relates to laser application technology, in particular to a laser cutting device. Background technique [0002] Traditional glass cutting adopts mechanical methods. With the continuous increase of market demand, the manufacturing industry has higher and higher requirements for production capacity, yield and glass quality. Mechanical methods are no longer suitable for the current process requirements. Laser cutting glass does not produce micro-cracks, which greatly improves the yield rate and saves the subsequent grinding process. Laser cutting not only improves production capacity, but also increases production efficiency. Therefore, laser glass cutting technology has become the future development direction, and will completely replace the existing mechanical cutting process in the near future. [0003] With the continuous development of the industry, the quality of glass cutting is also constantly improving. Among them, an important f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/02
CPCY02P40/57
Inventor 柳啸杨名宇彭裕国高云峰
Owner 深圳市大族半导体装备科技有限公司