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Method for producing water-resistant aluminum nitride

A manufacturing method and technology of aluminum nitride, applied in chemical instruments and methods, nitrogen compounds, inorganic chemistry, etc., can solve the problems of reduced thermal conductivity on the surface of aluminum nitride powder, and achieve the effect of high thermal conductivity

Inactive Publication Date: 2014-01-01
TOKUYAMA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, with this technology, although high water resistance can be obtained, in addition to the coating layer formed by phosphoric acid treatment on the powder surface, an aluminum oxide layer is also formed, so the thermal conductivity of the aluminum nitride powder surface is further reduced. The problem

Method used

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  • Method for producing water-resistant aluminum nitride
  • Method for producing water-resistant aluminum nitride
  • Method for producing water-resistant aluminum nitride

Examples

Experimental program
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Effect test

Embodiment 1

[0098] Aluminum nitride powder (H grade, BET specific surface area 2.6m 2 / g, produced by Tokuyama Co., Ltd.) 1kg, phosphoric acid (H 3 PO 4 , special grade, purity 85wt%, manufactured by Wako Pure Chemical Industries Co., Ltd.) 9.4 g and 1.5 kg of water were mixed in a mortar, and dispersed under a pressure of 100 MPA using a Nanomizer (NMS-200L, manufactured by Nanomizer Co., Ltd.). mix. Next, the dispersed mixture was dried at an inlet temperature of 200°C using a spray dryer (R-100, manufactured by Purisu Co., Ltd.), and then dried in an oven at 120°C for 15 hours to obtain water-resistant AlN powder.

[0099] Table 1 shows the water resistance of the obtained aluminum nitride powder, and the viscosity and thermal conductivity of the composite material produced using the aluminum nitride powder.

Embodiment 2

[0101] Aluminum nitride powder (H grade, BET specific surface area 2.6m 2 / g, produced by Tokuyama Co., Ltd.) 1kg, phosphoric acid (special grade, purity 85wt%, manufactured by Wako Pure Chemical Industries Co., Ltd.) 7.1g and ethanol 1.5kg were dispersed and mixed, and dried at 100°C for 15 hours to obtain Water resistant aluminum nitride powder.

[0102] Table 1 shows the water resistance of the obtained aluminum nitride powder, and the viscosity and thermal conductivity of the composite material produced using the aluminum nitride powder.

Embodiment 3

[0104] Aluminum nitride powder (H grade, BET specific surface area 2.6m 2 / g, produced by Tokuyama Co., Ltd.) 1kg, phosphoric acid (special grade, purity 85wt%, manufactured by Wako Pure Chemical Industries, Ltd.) 4.7g, phenylphosphonic acid (manufactured by Wako Pure Chemical Industries, Ltd.) 0.1g and isopropyl After dispersing and mixing 1.5 kg of alcohol, it was dried at 200° C. for 15 hours to obtain a water-resistant aluminum nitride powder.

[0105] Table 1 shows the water resistance of the obtained aluminum nitride powder, and the viscosity and thermal conductivity of the composite material produced using the aluminum nitride powder.

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Abstract

The present invention relates to a method for producing a water-resistant aluminum nitride powder, the method being characterized in that a phosphoric acid compound treatment step is performed in which at least one species of phosphoric acid compound selected from the group consisting of phosphoric acid, metal salts of phosphoric acid, and organophosphoric acids having organic groups of C12 or less is brought into contact within a solvent with an aluminum nitride powder dispersed in the solvent such that the ratio of the median diameter and the primary particle diameter is 1.4-5, the phosphoric acid compound being present on the surface of the aluminum nitride powder at a proportion of 0.5-10 mg / m2 in terms of orthophosphoric acid ions.

Description

technical field [0001] The present invention relates to a method for producing water-resistant aluminum nitride powder. Specifically, it relates to a production method for obtaining an aluminum nitride powder that exhibits good water resistance while efficiently maintaining the excellent thermal conductivity of the aluminum nitride powder itself. [0002] When the water-resistant aluminum nitride powder produced by the method of the present invention is filled in a composite material for heat release, high thermal conductivity can be imparted to the composite material for heat release. Background technique [0003] In recent years, along with the increase in power density of semiconductor devices, exothermic materials are required to have higher exothermic properties. [0004] As materials that realize heat dissipation in semiconductor devices, there is a series of materials called thermal interface materials, and their use is rapidly expanding. The path through which the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B21/072
CPCC01P2006/12C01P2002/80C01P2006/32C01B21/0728C01P2006/22C01P2006/90H01L23/3731C01P2004/62C01P2004/61H01L2924/0002H01L2924/00C01B21/072C09K5/14
Inventor 大野秀树王猛玉垣萌
Owner TOKUYAMA CORP
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