A packaging structure of led fluorescent tubes with high production efficiency

Abstract

The invention discloses an LED (Light Emitting Diode) sunlight packaging structure with high production efficiency. The LED sunlight packaging structure with the high production efficiency comprises a lamp tube which is formed by a lamp cover and a radiator and LED emitting chips which are arranged inside the lamp tube; an insulating layer with a through hole is arranged on the radiator; the LED emitting chips which are arranged inside the through hole of the insulating layer are closely adhered to the radiator; electrodes of the adjacent LED emitting chips are directly connected through leads to form into series connection or parallel connection; the leads and the radiator are arranged on bilateral sides of the insulating layer to be separated; two ends of the radiator are connected with connecting circuit boards; electrodes of the head and the tail of the LED emitting chips on the radiator after series connection or parallel connection are connected through the leads on the two connecting circuit boards. The LED sunlight packaging structure with the high production efficiency has the advantages of not needing to be welded to the connecting circuit boards after a pin is welded to every LED emitting chip, reducing welding procedures, not needing to designing the connecting circuit boards to be too long, saving the connecting circuit boards and reducing production costs.

Description

technical field [0001] The invention relates to the packaging field of LED fluorescent tubes, in particular to an LED fluorescent tube packaging structure with high production efficiency. Background technique [0002] At present, in the known LED fluorescent tube structure, the LED light-emitting chip is installed in the lamp bead and connected to the aluminum substrate through the lamp bead pin. Due to the complicated manufacturing process of the lamp bead, it includes stamping of the lamp bead bracket, electroplating of the bracket, injection molding of the bracket, The automation equipment needed for each process is very expensive, such as lamp bead crystal fixation, gold wire soldering, silica gel phosphor dotting, baking, lamp bead splitting, lamp bead packaging, etc., so the manufacturing cost of lamp beads is high, and in the above structure The heat of the LED light-emitting chip is transmitted through the narrow lamp bead pins, and the aluminum substrate dissipates ...

AI Technical Summary

Problems solved by technology

[0002] At present, in the known LED fluorescent tube structure, the LED light-emitting chip is installed in the lamp bead and connected to the aluminum substrate through the lamp bead pin. Due to the complicated manufacturing process of the lamp bead, it includes stamping of the lamp bead bracket, electroplating of the bracket, injection molding of the bracket, The automation equipment needed for each process is very expensive, such as lamp bead crystal fixation, gold wire soldering, silica gel phosphor dotting, baking, lamp bead splitting, lamp bead packaging, etc., so the manufacturing cost of lamp beads is high, and in the above structure The heat of the LED light-emitting chip is transmitted through the narrow lamp bead pins, and the aluminum substrate dissipates heat into the air. The heat dissipation path is narrow and the heat dissipation effect is poor. Patent No. 201220319756.9 Chinese patent, the LED fluorescent tube directly fixes the LED light-emitting chip to the heat sink to minimize the heat dissipation path, and the heat dissipation efficiency is high. Pins, and then solder the pins of each LED light-emitting chip to the connection circuit board, and connect each LED light-emitting chip through the connection circuit board, thereby eliminating the need for lamp beads and reducing production costs

However, the above-mentioned structure still has the following defects: one, it is necessary to weld the pins on each LED light-emitting chip, and the pins are welded to the connection circuit board, the welding process is many, the processing is cumbersome, and the production efficiency is reduced; In order to separate the pins from the heat sink, the length of the connecting circuit board is designed to be greater than or equal to the length of all LED light-emitting chips, which greatly increases the production cost during mass production

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