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Light-emitting diode packaging structure

A technology of light-emitting diodes and packaging structures, which is applied to electrical components, electrical solid-state devices, circuits, etc., and can solve problems such as cost increase

Active Publication Date: 2016-07-06
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, using a variety of LED chips or a variety of phosphors will increase the cost

Method used

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  • Light-emitting diode packaging structure

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Embodiment Construction

[0009] Please refer to figure 1 , is a schematic cross-sectional view of the light emitting diode package structure 100 provided by the embodiment of the present invention. The light emitting diode packaging structure device 100 includes a base 10, a first lead 20 and a second lead 30 respectively fixed on opposite ends of the base 10, a first lead 20 and a second lead 30 respectively installed on the first lead 20 and the second lead 30. The light emitting diode 40 , the second light emitting diode 50 , and the packaging body 60 covering the first light emitting diode 40 and the second light emitting diode 50 .

[0010] The base 10 includes a base 11 and a reflection cup 12 formed on the base 11 . The reflecting cup 12 is annular, and a recess (not shown) is formed in its middle. Both the first pin 20 and the second pin 30 are made of metal material, bent into a U-shape, and respectively passed through opposite ends of the base 11 of the base 10 . The first pin 20 and the ...

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Abstract

A light-emitting diode packaging structure, which includes a first light-emitting diode chip, a second light-emitting diode chip and phosphor powder. The light emitted by the first LED chip has a first wavelength. The light emitted by the second LED chip has a second wavelength. Both the first wavelength and the second wavelength are distributed between 380 nanometers and 480 nanometers, and the difference between the first wavelength and the second wavelength is less than or equal to 15 nanometers. The fluorescent powder is located on the light output path of the first LED chip and the second LED chip, the excitation wavelength of the fluorescent powder is distributed between 550 nm and 560 nm, and the fluorescent powder is located between the first LED chip and the second LED chip. Under the excitation of the light emitted by the diode chip, the wavelengths of the light emitted by the first light emitting diode chip and the second light emitting diode chip are converted.

Description

technical field [0001] The invention relates to a light emitting diode packaging structure. Background technique [0002] Light Emitting Diode (LED, Light Emitting Diode) has the advantages of high brightness, low operating voltage, low power consumption, easy matching with integrated circuits, simple driving, long life, etc., so it can be used as a light source and widely used in the lighting field. For details, please refer to Joseph Bielecki et al. People in the literature 2007IEEE, 23rdIEEESEMI-THERMSymposium in the ThermalConsiderationsforLEDComponentsinanAutomotiveLamp article. A light emitting diode is a semiconductor element that converts electrical current into light of a specific wavelength range. [0003] Generally, different regions of a single wafer have different lattice qualities due to uneven gas divergence during the epitaxy process, that is, different regions of the same wafer have different lattice qualities. LED grains of different lattice qualities pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/50
Inventor 叶辅湘林新强曾文良张洁玲
Owner ZHANJING TECH SHENZHEN
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