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Adhesive with enhanced reliability under high pressure and tape for semiconductor packaging using the same

A technology of adhesives and tapes, applied in the direction of polymer adhesive additives, semiconductor devices, film/sheet adhesives, etc., can solve problems such as poor adhesiveness, and achieve insulation reliability and high lead resistance The effect of migration performance

Inactive Publication Date: 2017-05-24
TORAY ADVANCED MATERIALS KOREA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the brittleness of the thermoset network composed of only thermoset resins containing a small equivalent weight, the adhesiveness is poor at high temperature

Method used

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  • Adhesive with enhanced reliability under high pressure and tape for semiconductor packaging using the same
  • Adhesive with enhanced reliability under high pressure and tape for semiconductor packaging using the same
  • Adhesive with enhanced reliability under high pressure and tape for semiconductor packaging using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0104] Embodiment 1 manufactures viscose

[0105] With respect to 100 parts by weight of the epoxy-based epoxy resin (XD-1000 of Nippon Kayaku of Japan) as component (a), 50 parts by weight of bisphenol A novolac resin (the product of Momentive Corporation of the United States) SD1508, number average molecular weight is 3100, epoxy equivalent is 120) as the first epoxy curing agent of component (b), 40 parts by weight of styrene-maleic anhydride (number average molecular weight is 4500, epoxy equivalent is 260) The second epoxy curing agent as component (c), 0.1 parts by weight of 2-methylimidazole as the curing accelerator of component (d), 80 parts by weight of nitrile rubber as the ) modifier formed by thermoplastic resin, 0.1 parts by weight of component (f) fluorosurfactant (FC4430 of 3M in the United States) was added as an additive to methyl ethyl ketone solvent, by mixing them at room temperature and atmospheric pressure for five Hours, thereby making the viscose varn...

Embodiment 2

[0106] Embodiment 2 manufactures viscose

[0107] With respect to 100 parts by weight of bisphenol A epoxy resin (KDS-8128 of Kukdo Chemical Co.) as the epoxy-based resin of component (a), 50 parts by weight of novolac resin (MEH of Myungsung Hwasung Co., Japan) -7500H, number average molecular weight is 290, epoxy equivalent is 97) as the first epoxy curing agent of component (b), 40 parts by weight of styrene-maleic anhydride (number average molecular weight is 4500, epoxy equivalent 260) the second epoxy curing agent as component (c), 0.1 parts by weight of 2-methylimidazole as the curing accelerator of component (d), 70 parts by weight of nitrile rubber and 10 parts by weight of Phenoxy resin is used as a modifier formed by the thermoplastic resin of component (e), and 0.1 parts by weight of component (f) fluorosurfactant (FC4430 of 3M in the United States) is added to the methyl ethyl ketone solvent as an additive. They were mixed for five hours at room temperature and a...

Embodiment 3

[0108] Embodiment 3 manufactures viscose

[0109]With respect to 100 parts by weight of bisphenol A epoxy resin (KDS-8128 of Kukdo Chemical Co.) as the epoxy-based resin of component (a), 60 parts by weight of novolak resin (MEH of Myungsung Hwasung Co., Japan) -7500H, the number average molecular weight is 290, and the epoxy equivalent is 97) as the first epoxy curing agent of component (b), 40 parts by weight of polyetheramine mixed in a weight ratio of 1:1 (U.S. Huntsman Co. T-5000) and styrene-maleic anhydride (number average molecular weight of 4500, epoxy equivalent of 260) as the second epoxy curing agent of component (c), 0.1 parts by weight of 2-methyl Imidazole as a curing accelerator of component (d), 70 parts by weight of nitrile rubber and 10 parts by weight of phenoxy resin as a modifier formed from the thermoplastic resin of component (e), 0.1 parts by weight of The fluorosurfactant (FC4430 of 3M in the United States) of point (f) was added as an additive to th...

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Abstract

The present invention relates to an adhesive having electrical reliability under high pressure and a semiconductor encapsulating tape using the same. In the adhesive of the present invention, since an optimal amount of epoxy curing agent is included in the epoxy-based resin, so as to enhance the fracture toughness by enhancing the crosslinking density, thereby ensuring the electrical reliability at a high voltage of 30V or above, Excellent high-temperature adhesive properties at 200°C or above due to strong cross-linking of molecules within the cured network. Therefore, the adhesive of the present invention can be used as an adhesive tape which is very useful in the field of semiconductor packaging, which is accompanied by high-temperature processes of 200°C or above, such as wire bonding, soldering, etc., and can also be effectively used in the field of applying high voltage , such as elevators, vehicles, semiconductor packaging, etc.

Description

technical field [0001] The present invention relates to an adhesive having enhanced electrical reliability under high pressure and an adhesive tape for semiconductor packaging using the adhesive. More specifically, it relates to an adhesive having electrical reliability under high voltage and a tape for semiconductor packaging using the adhesive, wherein an epoxy-based resin contains an optimum amount of epoxy-cured agent in order to enhance the fracture toughness by increasing the cross-link density, thereby ensuring electrical reliability at high voltages of 30V or above, and excellent performance at high temperatures of 200°C or above because the molecules are strongly cross-linked within the cured network High temperature adhesiveness. Background technique [0002] Various lead frames for mounting semiconductors are manufactured according to factors such as width, thickness, semiconductor package area, lead length, chip pad area, etc. A typical structure of a lead fram...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J7/02
CPCH01L2924/0002H01L2924/00C09J7/22C09J7/30C09J7/40C09J11/08C09J163/00C09J2203/326C09J2301/312H01L21/02002H01L21/6836
Inventor 洪昇佑崔城焕金晟镇金演秀
Owner TORAY ADVANCED MATERIALS KOREA