Manufacturing method of printed circuit board
A technology of printed circuit boards and manufacturing methods, which is applied in the direction of multilayer circuit manufacturing, etc., and can solve problems such as inability to improve production efficiency and inability to achieve satisfactory flatness of dielectric layers
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Embodiment 1
[0021] see figure 1 and 2 , the invention provides a manufacturing method comprising the following steps in turn:
[0022] (1) Provide substrate 1;
[0023] (2) forming a plurality of first conductive patterns 2 on the substrate 1;
[0024] (3) Coating a photocurable first dielectric layer 3 on the plurality of first conductive patterns 2;
[0025] (4) Light curing the first dielectric layer 3;
[0026] (5) performing laser drilling on the first dielectric layer on the plurality of first conductive patterns 2 until the plurality of first conductive patterns 2 are exposed;
[0027] (6) forming a plurality of second conductive patterns 5;
[0028] Among them, there are a plurality of first openings 11 between the plurality of first conductive patterns 2 on the substrate 1; the first dielectric layer 3 completely covers the plurality of first openings 11; The first dielectric layer 3 on the 2 is formed with a plurality of second openings 12; a part of the plurality of seco...
Embodiment 2
[0036] see figure 1 and 3 , the invention provides a manufacturing method comprising the following steps in turn:
[0037] (1) Provide substrate 1;
[0038] (2) forming a plurality of first conductive patterns 2 on the substrate 1;
[0039] (3) Coating a photocurable first dielectric layer 3 on the plurality of first conductive patterns 2;
[0040] (4) Light curing the first dielectric layer 3;
[0041] (5) Carry out light curing after spin-coating the second dielectric layer 4 on the first dielectric layer 3;
[0042] (6) performing laser drilling on the first dielectric layer 3 and the second dielectric layer 4 on the plurality of first conductive patterns 2 until the plurality of first conductive patterns 2 are exposed;
[0043] (7) forming a plurality of second conductive patterns 5;
[0044] Among them, a plurality of first openings 11 are formed between the plurality of first conductive patterns 2 on the substrate 1; the first dielectric layer 3 completely covers ...
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