Unlock instant, AI-driven research and patent intelligence for your innovation.

A method for electroplating thin-film circuit patterns on ultra-thin quartz substrates

A thin-film circuit and substrate technology, which is applied in the manufacture of circuits, printed circuits, and printed circuits, can solve the problems of complex process, high price, and limited selection of temporary bonding materials, and achieve simple process and low cost. The effect of low cost and high yield rate

Active Publication Date: 2016-04-13
CHINA ELECTRONIS TECH INSTR CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the biggest disadvantage of the above method is that the necessary auxiliary equipment such as temporary bonding machines, polishing machines and temporary debonding machines used for electroplating thin film circuit patterns on ultra-thin quartz substrates are expensive and have complicated processes. More restricted

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method for electroplating thin-film circuit patterns on ultra-thin quartz substrates
  • A method for electroplating thin-film circuit patterns on ultra-thin quartz substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] like figure 1 as shown, figure 1 A flow chart of a method for electroplating thin film circuit graphics on an ultra-thin quartz substrate provided by the present invention, the method includes the following steps:

[0033] Step 101: At least one ultra-thin quartz substrate is polished on both sides, and a surface to be electroplated is provided on one side, and the surface to be electroplated is composed of a metal film pattern and a bonding area; the side of the substrate is polished , and form a metallized polished surface;

[0034] Step 102: Turn the conductive surface of the ultra-thin quartz substrate to be electroplated upwards, and bond the other side with the metallized and polished surface of the carrying substrate through photoresist to form a temporary bonding body;

[0035] Step 103: Form a bonding area and an electroplating connection area on the metallized polished surface of the carrier substrate of the temporary bonding body by mask photolithography, a...

Embodiment 2

[0047] On the basis of the above-described embodiments, the following non-limiting examples further illustrate a method of the present invention for electroplating thin-film circuit patterns on ultra-thin quartz substrates, such as figure 2 As shown, two ultra-thin quartz substrates with different shapes and sizes and polished on both sides are provided, and the surface to be electroplated is set on one side, and the other side of the ultra-thin quartz substrate is set as a full-plate thin film metallization seed The layer ground plane, or the surface of the conductive path seed layer composed of an arrayed metal film pattern and a bonding area. Put the surface of these two ultra-thin quartz substrates to be electroplated metal film facing up, and use the method of spin-coating RZJ-390PG positive photoresist (viscosity 50mPa.s) to glue the back side to the metallized polished surface of the carrier substrate Form a temporary bonding body, and then realize the fabrication of e...

Embodiment 3

[0055] like figure 2 As shown, two ultra-thin quartz substrates with different shapes and sizes and double-sided polishing are provided, and the surface to be electroplated is set on one side, and the other side of the ultra-thin quartz substrate is set to be formed by an arrayed metal film pattern. The surface of the conductive path plating layer composed of the bonding area, or the ground plane of the full-board thin film metallization plating layer. Put the surface of the two ultra-thin quartz substrates to be electroplated with the metal film facing up, and use the method of spin-coating BP-218 positive photoresist (viscosity 150mPa.s) to glue the back side to the metallized polished surface of the carrier substrate Form a temporary bonding body, and then realize the fabrication of electroplated thin film circuit patterns on ultra-thin quartz substrates.

[0056] Firstly, two ultra-thin quartz substrates 4 whose surfaces to be electroplated are made of metal thin film pa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention provides a method for electroplating film circuit patterns on ultrathin quartz substrates. The method comprises the following steps that the surface, for electroplating the film circuit pattern, of at least one ultrathin quartz substrate is put upward, the rear face of the ultrathin quartz substrate and the metallized polished face of a bearing substrate are bonded together to form a temporary bonding body through using an ultraviolet sensitive positive photoresist as a binder, and further the process of electroplating the film circuit pattern on the ultrathin quartz substrate is realized. By adopting the scheme, single-faced or double-faced film circuit pattern electroplating can be performed on the ultrathin quartz substrate, the process is simple and easy to implement, the cost is low, and the yield is high; the ultrathin quartz substrate is picked up and put down by being absorbed by a vacuum pen, so that rejects caused by manmade substrate damage are avoided; in the method, the bearing substrate can bear multiple ultrathin quartz substrates for operation at a time, and can be repeatedly used, so that the method is suitable for batch production.

Description

technical field [0001] The invention belongs to the technical field of millimeter wave and submillimeter wave integrated circuit manufacturing, and in particular relates to a method for electroplating thin film circuit patterns on ultra-thin quartz substrates. Background technique [0002] Quartz substrates are commonly used as circuit substrates for components in the terahertz frequency band. The material is high-purity isotropic fused silica. The reason is that the dielectric constant of quartz is relatively stable in the hundreds of GHz frequency band, and the loss is lower than that in the current microwave and millimeter wave frequency bands. The substrate material is also relatively stable in terms of thermal and mechanical properties. Quartz substrate thin film circuit patterns are usually prepared by large substrates and multi-units in the semiconductor integrated circuit process. The process includes: substrate cleaning, coating, photoetching, electroplating thick g...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/027
CPCH01L21/707H05K3/188
Inventor 曹乾涛路波王斌宋振国胡莹璐孙建华邓建钦李平
Owner CHINA ELECTRONIS TECH INSTR CO LTD