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COB (chip on board) encapsulating method

A packaging method and circuit layer technology, applied to electrical components, circuits, semiconductor devices, etc., can solve problems such as air bubbles

Active Publication Date: 2014-03-19
HONGLI ZHIHUI GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a COB packaging method, which can effectively solve the problem of air bubbles after COB sealing of composite substrates, and will not cause problems such as uneven distribution of phosphor powder and color drift.

Method used

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  • COB (chip on board) encapsulating method
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  • COB (chip on board) encapsulating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Such as figure 1 , 2 As shown, a COB packaging method includes the following steps:

[0029] (1) Apply bonding glue on the back of the substrate circuit layer 2; assuming that the entire substrate area is A, when the die-bonding functional area is circular and the radius is R, the bonding glue area is A-π , when the crystal-bonding functional area is square, the length is L and the width is D, then the area of ​​the bonding glue is A-(L-0.3)*(D-0.3), that is, the bonding glue is 0.3mm away from the edge of the crystal-bonding functional area , and then control the thickness of the bonding glue at 25±5μm, so that by controlling the coating amount of the bonding glue, the overflow of the bonding glue can be controlled, so that the overflowing bonding glue will not have a large impact on the die-bonding functional area 3 influences;

[0030] (2) Press the substrate circuit layer 2 onto the surface of the metal substrate layer 1. The substrate circuit layer 2 is provide...

Embodiment 2

[0036] Such as figure 1 , 3 As shown, a COB packaging method includes the following steps:

[0037] (1) Apply laminating glue on the back of the circuit layer 2 of the substrate;

[0038] (2) Press the substrate circuit layer 2 onto the surface of the metal substrate layer 1. The substrate circuit layer 2 is provided with through holes corresponding to the crystal bonding functional area 3 on the metal substrate layer 1, and the substrate circuit layer 2 and the metal substrate layer 1 are pressed together. Afterwards, the crystal-bonding functional area 3 is exposed through the through hole;

[0039] (3) Dot a layer of glue on the joint 4 on the edge of the through hole to cover the joint on the edge of the through hole, and the distance of the dotted glue layer to the direction of the crystal bonding functional area 3 is less than 5mm;

[0040] (4) Die bonding wires in the die bonding functional area 3;

[0041] (5) Seal the COB.

[0042] After the substrate circuit lay...

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Abstract

The invention relates to a COB (chip on board) encapsulating method. The method comprises the following steps of (1) coating the back surface of a substrate circuit layer with laminating glue; (2) laminating the substrate circuit layer onto the surface of a metal substrate layer, wherein a solid crystal functional area, corresponding to the metal substrate layer, on the substrate circuit layer is provided with a through hole, and the solid-crystal functional area is exposed through the through hole after the substrate circuit layer is laminated with the metal substrate layer; (3) completely covering a joint surface between the substrate circuit layer and the metal substrate layer with the laminating glue, and covering the junction on the edge of the through hole through the laminating glue which overflows from the junction on the edge of the through hole or by applying a layer of glue to the junction on the edge of the through hole; (4) carrying out solid-crystal welding on a wire in the solid-crystal functional area; and (5) sealing a COB. By adopting the method, bubbles can be fundamentally avoided at the source, and the subsequent encapsulation process can be facilitated.

Description

technical field [0001] The invention relates to LED lighting, in particular to a COB packaging method. Background technique [0002] At present, the composite substrate adopts a thermoelectric separation structure. In order to ensure that the reflective area of ​​the die-bonding functional area is sufficient, when the circuit layer and the metal substrate layer are pressed together, the amount of lamination glue will be relatively small, resulting in the circuit layer and the metal substrate layer. There are some small gaps between them, and these small gaps will cause air bubbles in the glue after sealing. In the prior art, there are two methods to solve the problem of air bubbles in the colloid after COB sealing of this kind of composite substrate. One is to place the glue in a vacuum machine before curing before curing, and the other is to cure at a low temperature after sealing. Degassing and high-temperature solidification staged curing. No air bubbles will appear aft...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/52
CPCH01L33/005H01L33/52
Inventor 毛卡斯石超黄巍周志勇王芝烨
Owner HONGLI ZHIHUI GRP CO LTD