Direct sensing biofets and fabrication methods

Abstract

Direct sensing BioFETs and fabrication methods. The present invention provides biofield effect transistors (BioFETs) and methods of making BioFET devices. The method includes forming the BioFET using one or more process steps compatible with or typical of a complementary metal oxide semiconductor (CMOS) process. BioFET devices include multiple microwells with sense gate bottoms and a number of stacked well sections. The bottom surface area of ​​the well portion is different from the top surface area of ​​the well portion directly below it. The microwells are formed by multiple etching operations through different materials, including sacrificial plugs, exposing the sense gates without plasma-induced damage.

Description

technical field [0001] The present invention relates to biosensors and methods of forming biosensors, and more particularly, the present invention relates to biofield effect transistors (bioFETs) and methods of forming them. Background technique [0002] Biosensors are devices for sensing and detecting biomolecules and operate based on electronic, electrochemical, optical and mechanical detection principles. Biosensors comprising transistors are sensors that electrically sense the charge, photon and mechanical properties of biological entities or biomolecules. Detection can be performed by detecting the biological entity or biomolecule itself, or by the interaction and reaction between specific reactants and the biological entity / biomolecule. These biosensors can be fabricated using semiconductor processes, which can rapidly convert electrical signals, and can be easily applied to integrated circuits (ICs) and MEMS. [0003] A BioFET (biofield effect transistor, biosensiti...

AI Technical Summary

Problems solved by technology

Although BioFETs have advantages in many aspects, they still face challenges in their manufacture and / or operation, for example, due to compatibility issues between semiconductor manufacturing processes, biological applications, constraints and / or limitations on semiconductor manufacturing processes, electrical Integration of signaling and biological applications and / or other challenges arising from the implementation of large scale integration (LSI) processes

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