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A kind of waterproof patch LED and its production process

A production process and patch technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of waterproof and poor moisture-proof performance, and achieve a good waterproof effect

Inactive Publication Date: 2016-09-14
上海格灵奥智能科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The embodiment of the present application provides a waterproof patch LED and its production process, which solves the technical problems of poor waterproof and moisture-proof performance of the existing patch LED in the prior art, and realizes that the patch LED has good waterproof , technical effect of moisture resistance

Method used

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  • A kind of waterproof patch LED and its production process
  • A kind of waterproof patch LED and its production process
  • A kind of waterproof patch LED and its production process

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Embodiment 1

[0042] In Embodiment 1, a waterproof SMD LED is provided, please refer to Figure 1-Figure 4 , the SMD LED includes:

[0043] A package body 10, the package body 10 is specifically an epoxy resin package body;

[0044] Plastic sealing molding bracket 20, one end of the plastic sealing molding bracket 20 protrudes into the inside of the package body 10, the plastic sealing molding bracket 20 is provided with a crystal-bonding area, and an LED chip is fixed in the crystal-bonding area, wherein the Waterproof grooves 201 and waterproof holes 202 are provided on the pins of the molded bracket.

[0045] Wherein, in the embodiment of the present application, the lead of the plastic molding bracket 20 has two ends, one end is located in the package body 10 , and the other end is bent through the package body 10 to the bottom of the package body 10 .

[0046] Wherein, in the embodiment of the present application, the plastic molding bracket 20 is electrically connected to the LED c...

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Abstract

The invention discloses a waterproof chip LED (Light-Emitting Diode) and a production technology thereof. The chip LED comprises: a package main body, which is an epoxy resin package main body, and a plastic-package molded bracket, wherein one end of the plastic-package molded bracket stretches into the internal of the package main body, the plastic-package molded bracket is provided with a wafer fixing area in which LED wafers are fixed, and the pin of the plastic-package molded bracket is provided with a waterproof slot and a waterproof hole; and therefore, the technical effect that the chip LED has good water resistance and moisture resistance performances is achieved.

Description

technical field [0001] The invention relates to the field of optoelectronic technology, in particular to a waterproof patch LED and a production process thereof. Background technique [0002] In recent years, SMD LED has become a development hotspot, which solves problems such as brightness, viewing angle, flatness, and consistency, and is very suitable for the application of high-resolution indoor full-color display screens. However, with the increasing popularity of LEDs, the performance requirements are getting higher and higher. It is required to meet the high-resolution outdoor, outdoor full-color display screens and outdoor building applications. Ordinary SMD LEDs have low waterproof performance and cannot be placed for a long time. Used in humid and harsh environments. [0003] The difficulty of patch LED waterproofing is mainly caused by two aspects: one is the water seepage of the LED bracket. The water seepage of the LED bracket is caused by the material of the b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/52
CPCH01L25/13H01L33/54H01L2933/005
Inventor 谢月冬陈可
Owner 上海格灵奥智能科技有限公司
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