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Grinding speed detection apparatus, grinding device and method for detecting grinding speed in real time

A technology of grinding rate and reconnaissance devices, which is applied in the direction of grinding devices, grinding machine tools, metal processing equipment, etc., can solve the problems of inability to monitor the grinding rate in real time, achieve the effects of improving grinding efficiency, reducing wafer cost, and avoiding damage

Inactive Publication Date: 2014-04-30
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention overcomes the problem that the grinding rate cannot be monitored in real time, and proposes a grinding rate detection device, grinding equipment and a method for real-time monitoring of the grinding rate, and monitors the grinding rate in real time by detecting the voltage value of the motor that drives the grinding pad finishing disc , which can ensure that the grinding rate is within the set range during the grinding process, improve the stability of chemical mechanical grinding, thereby improving the grinding efficiency and reducing the cost of the wafer

Method used

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  • Grinding speed detection apparatus, grinding device and method for detecting grinding speed in real time
  • Grinding speed detection apparatus, grinding device and method for detecting grinding speed in real time
  • Grinding speed detection apparatus, grinding device and method for detecting grinding speed in real time

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Embodiment 1

[0038] This embodiment relates to a grinding rate detection device, figure 1 It is a structural representation of the grinding rate detection device in the present embodiment; as figure 1As shown, a polishing pad finishing disk 4, a motor 7 connected to the polishing pad finishing disk 4 for driving the polishing pad finishing disk, is provided with a voltage detector 6 on the motor 7, which can be connected through a suitable connection Connect with the motor 7, the motor 7 drives the polishing pad finishing disc 4 that is in contact with the polishing pad 2, the operating voltage of the motor is affected by the frictional force that the polishing pad finishing disc 4 receives from the grinding pad 2, and the polishing pad finishing disc 4 receives The frictional force given by the grinding pad 2 is affected by the grinding rate; when the grinding rate detection device starts, the motor 7 drives the grinding pad finishing disc 4 to rotate around the axis of the grinding pad f...

Embodiment 2

[0041] This embodiment relates to a kind of grinding equipment, and the grinding equipment comprises a grinding machine table 21 and a grinding rate detection device 20, figure 2 It is a side view of the grinding machine platform and the grinding rate detection device of the present invention; image 3 It is a top view of the grinding machine platform and the grinding rate detection device of the present invention; as figure 2 As shown, the grinding rate detection device 20 in the first embodiment is provided in the grinding machine table 21, and the grinding rate detection device includes a grinding pad finishing disc 4, a motor 7 and a voltage detector 6; a grinding disc is provided on the grinding machine table 21 1 (can have 1-3, take one example), the upper surface of the grinding disc 1 is provided with a layer of grinding pad 2, the grinding pad 2 completely covers the grinding disc 1, and the center of the lower surface of the grinding disc 1 is connected with a rota...

Embodiment 3

[0047] This embodiment relates to a method for real-time scouting of the grinding rate, which is applied to the grinding machine table 21, Figure 4 Be the flowchart of grinding rate detection method of the present invention, as figure 2 and 4 As shown, the steps are as follows:

[0048] Step 1: preset a grinding rate detection device 20 in the grinding machine, the grinding rate detection device 20 includes a polishing pad finishing disc 4, a motor 7 and a voltage detector 6;

[0049] Step 2: Start the grinding rate detection device 20 and the grinding machine table 21, the motor 7 drives the grinding pad finishing disc 4 to rotate, the grinding pad finishing disc 4 changes the output power of the motor 7 through the grinding rate of the grinding machine table 21, and the voltage detection The detector 6 displays the working voltage of the motor 7 in real time according to the output power of the motor 7;

[0050] Step 3: Determine whether the operating voltage of the mot...

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Abstract

The invention discloses a grinding speed detection apparatus, a grinding device and a method for detecting a grinding speed in real time, wherein the grinding speed is monitored in real time by detecting the voltage value of a motor for driving a grinding pad finishing disc, in this way, the grinding speed within a set range during a grinding process can be ensured, and the stability of chemical mechanical grinding can be improved, thus increasing the grinding efficiency and reducing the cast of wafers.

Description

technical field [0001] The invention relates to the field of semiconductor device manufacturing, in particular to a grinding rate scouting device, grinding equipment and a method for real-time scouting grinding rate Background technique [0002] Generally, the CMP process performed in a semiconductor process workshop refers to a chemical mechanical polishing (Chemical Mechanical Polishing) process or a chemical mechanical planarization (Chemical Mechanical Planarization) process. The chemical mechanical polishing process is a complicated process. It contacts the surface of the wafer with the surface of the polishing pad, and then flattens the surface of the wafer through the relative movement between the surface of the wafer and the polishing surface. Chemical mechanical polishing equipment is usually used. , also known as a grinding machine or a polishing machine for chemical mechanical grinding processes. The grinding machine table includes a chemical mechanical grinding ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/005B24B37/32
CPCB24B37/005
Inventor 严钧华朱也方王从刚丁弋
Owner SHANGHAI HUALI MICROELECTRONICS CORP