Single BGA product patch invert-mounting device and use method thereof
A patch device and product technology, applied in the direction of electrical components, electrical components, etc., can solve problems such as substrate tilt, bump virtual welding, product virtual welding, etc., to achieve the effect of ensuring accuracy and parallelism
Active Publication Date: 2014-05-07
JIANGNAN INST OF COMPUTING TECH
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Problems solved by technology
However, there are two risk points in the current carrier: one is that the parallelism between the contact surface of the substrate and the carrier and the bottom surface of the carrier cannot be detected, and errors in the coplanarity, parallelism, and depth of the carrier opening will lead to false welding of the product; The other is that the substrate is fixed by the spring mechanism on the carrier during flip-chip mounting. There is a great risk of substrate tilting, and it is impossible to detect whether the substrate is tilted during the clamping process.
Once the substrate is tilted, there will be a certain angle between the chip and the substrate during mounting, which will eventually lead to false soldering of some bumps
Method used
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[0020] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.
[0021] The invention reforms the carrier of the single BGA product flip-chip mounting device, and is used in conjunction with the vacuum platform of the single BGA product flip-chip mounting device. Because the vacuum platform can be adjusted according to the placement head, the vacuum platform is used to contact the substrate during flip chip placement, which ensures the parallelism between the chip and the substrate and prevents false welding of the product.
[0022] The single BGA product flip-chip placement device according to the preferred embodiment of the present invention includes a carrier and a vacuum fixture.
[0023] figure 2 It schematically shows the top view of the carrier of the single BGA product flip-chip placement device acc...
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The invention discloses a single BGA product patch invert-mounting device and a use method thereof. The single BGA product patch invert-mounting device comprises a carrier and a vacuum jig, a first recess portion and a second recess portion are formed on the carrier, the first recess portion is communicated with the second recess portion, an annular step is formed at the connecting position of the first recess portion and the second recess portion, the windowing size of the second recess portion is equal to or larger than the appearance size of a BGA product substrate, and the depth of the second recess portion is equal to or larger than the total thickness of the BGA product substrate with a chip, so that the BGA product substrate with the chip can be completely contained in the second recess portion on the annular step; the vacuum jig is provided with a base and a boss fixed on the base, and the size of the section of the boss is smaller than the windowing size of the first recess portion of the carrier, and larger than the size of the chip, so that the boss can penetrate through the first recess portion and the second recess portion, the size of section of the base is larger than the windowing size of the first recess portion of the carrier, and the height of the boss is larger than or equal to the thickness of the carrier. A communicating pipeline is formed in the vacuum jig.
Description
technical field [0001] The present invention relates to the field of integrated circuit packaging, and more specifically, the present invention relates to a single BGA (Ball Grid Array, ball grid array) product flip-chip mounting device and a use method thereof. Background technique [0002] With the development of light weight, thinner, miniaturized, I / O terminal numbers and functional diversification, the traditional packaging technology can no longer meet the high-density requirements. The development of flip-chip welding technology can solve this problem, and it is widely used in high-speed computers, electronic watches, mobile phones, automotive electrical appliances, medical equipment and communication products. Although the flip-chip technology cannot yet be applied in the high-reliability field, with the emergence of materials, new processes, and new structural designs, the reliability has been improved, and it will be more widely used in the future. [0003] In the...
Claims
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IPC IPC(8): H05K13/04
Inventor 梁少文孙忠新施陈高锋朱敏王彦桥刘晓阳
Owner JIANGNAN INST OF COMPUTING TECH