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Die and method for manufacturing die

A manufacturing method and mold technology, which is applied in the field of mold and mold manufacturing, can solve problems such as gaps in the heat insulation layer, and achieve the effect of suppressing gaps

Active Publication Date: 2014-05-07
POLYPLASTICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that a gap, etc., occurs on the heat insulating layer due to this friction.
However, there is a problem that a gap, etc., occurs on the heat insulating layer due to this friction.

Method used

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  • Die and method for manufacturing die
  • Die and method for manufacturing die
  • Die and method for manufacturing die

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Experimental program
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Effect test

no. 1 approach

[0032] figure 1 It is a figure which schematically shows the mold of this embodiment, figure 1 (a) is a stereogram, figure 1 (b) is a sectional view of the MM section. figure 2 is a perspective view schematically showing the inside of a mold main body in which a through-hole is formed, figure 2 (b) is figure 2 (a) Cross-sectional view of the NN profile. image 3 (a) is a perspective view schematically showing the inside of the mold main body in a state where the heat insulating layer is formed, image 3 (b) is a cross-sectional view of OO.

[0033] Such as figure 1 As shown, the mold 1 of this embodiment includes a mold body 10 , a through hole 11 , and a heat insulating layer 12 . A through hole 11 is provided in the mold main body 10 forming the outer shape of the mold. The through hole 11 penetrates between the cavity and the outside of the mold 1 , and a heat insulating layer 12 is arranged on the inner wall surface of the mold main body 10 . Among them, the mol...

no. 2 approach

[0070] In addition to the manufacturing method of the above-mentioned mold, the following method can also manufacture the mold of this invention. Figure 5 It is a figure which schematically shows the manufacturing method of 2nd Embodiment. use Figure 5 The manufacturing method of the second embodiment will be described, and when it is the same as that of the first embodiment, description may be appropriately omitted.

[0071] The manufacturing method of the second embodiment includes a second through-hole forming step in which a hole is formed from the top surface F of the convex portion 101 of the mold main body 10 3 The through hole 11 is formed along the height direction of the convex portion 101; the second heat insulating layer forming process, in the second heat insulating layer forming process, the shielding member for covering the through hole 11 and the outer periphery of the through hole 11 is arranged on the Top F 3 and form a heat insulating layer on the inner...

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PUM

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Abstract

The present invention provides a die and a method of manufacturing the die. Provided is a technique for minimizing chipping of an insulating layer or other problems in a die having the insulating layer formed therein, even when a penetrating member is inserted into a through-hole provided in the die. The die is provided with a die body having a protruding part on an inner wall surface, an insulating layer arranged on the inner wall surface, and a through-hole via which the protruding part is passed in the thickness direction of the die body and in which the penetrating member can be inserted. The outer periphery of the through-hole is present on the inside of the outer periphery of the top surface of the protruding part. It is desirable to have a gap of 0.5 mm or less between the outer periphery of the through-hole on the top surface of the protruding part, and the outer periphery of the top surface of the protruding part.

Description

technical field [0001] The present invention relates to a mold formed with a heat insulating layer and a manufacturing method of the mold. Background technique [0002] Thermoplastic resin is lighter than other materials such as metal, and it is easy to form a desired shape by injection molding, so it is used in various electrical and electronic components used in automobiles, office equipment, food containers, beverage containers, etc. used in the field. [0003] When a molten thermoplastic resin is filled into a mold as in injection molding to obtain a resin molded body of a desired shape, a pattern and shape for imparting a pattern and shape to the resin molded body are formed on the cavity surface of the mold. [0004] In order to improve the shape of the cavity surface and the transferability of the pattern to the resin molded article, methods such as improving the thermoplastic resin, mixing specific additives with the thermoplastic resin, or increasing the mold tempe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C33/38B29C45/26
CPCB29C33/02B29C2033/023B29C45/40B29C33/442B29C2033/3864B29C45/73
Inventor 宫下贵之广田晋一
Owner POLYPLASTICS CO LTD
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