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Packaging module, packaging terminal and manufacturing method thereof

A manufacturing method and terminal technology, applied in contact manufacturing, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as poor reliability and different stress relief effects, and achieve the effect of improving connection reliability.

Active Publication Date: 2014-05-28
DELTA ELECTRONICS SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In view of the problems existing in the prior art, the purpose of the present invention is to provide a packaged terminal to solve the technical problems of different stress release effects and poor reliability in different directions of the packaged terminal in the prior art

Method used

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  • Packaging module, packaging terminal and manufacturing method thereof
  • Packaging module, packaging terminal and manufacturing method thereof
  • Packaging module, packaging terminal and manufacturing method thereof

Examples

Experimental program
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Effect test

no. 1 example

[0051] Such as Figure 5 and Figure 6 As shown, the packaging terminal of the first embodiment of the present invention includes an end part 1, a bent part 2 and a base 3, wherein the first end of the bent part 2 is connected to the end part 1, and the second end of the bent part 2 Connect to base 3. In this embodiment, the end part 1 and the base 3 can be the same as the packaging terminal of the prior art, the difference is that the bent part has a C-shaped bend, and its cross-section is gradual, and the cross-sections of the two ends of the bent part 2 The area is the largest, and the area of ​​the section at the center is the smallest, hereinafter referred to as the second section. The area of ​​the cross-section of the bent part 2 gradually decreases from both ends of the bent part 2 toward the center, and the second cross-section (minimum cross-section) is at the center of the bent part 2, that is, Figure 5 The center position of the C-shaped bend in the left-right ...

no. 2 example

[0075] Figure 13 It is the packaging terminal of the second embodiment of the present invention. The difference from the first embodiment is that a chamfer 10 is added to the top of the end portion 1 . Because the package terminal 12 is positioned through the positioning hole on the PCB circuit board when the package terminal 12 is assembled with the PCB circuit board, in order to improve the assembly efficiency, the positioning hole of the PCB circuit board can be designed with a positive angle. Therefore, the end of the package terminal of this embodiment 1 The top end is chamfered to improve the convenience of assembly.

[0076] In each of the following embodiments, the top of the end portion 1 may be provided with a chamfer 10 , which will not be repeated here.

no. 3 example

[0078] Figure 14A and Figure 14B It is the packaging terminal of the third embodiment of the present invention.

[0079] The difference from the first embodiment is that the cylindrical surface of the base 3 is designed with an inner groove with a depth h. Because the package terminals 12 and the pads of the substrate 11 are soldered by solder, the groove structure on the base 3 can improve the soldering strength.

[0080] There is no essential difference between this embodiment and the first embodiment on the principle of elasticity.

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Abstract

The invention discloses a packaging module, a packaging terminal and a manufacturing method thereof. The packaging terminal comprises a base, an end part having a first section, and a bending part, wherein the bending part includes a C-shaped bend of which the section gradually changes, the bending part has a first end and a second end, the first end is connected to the end part, the second end is connected to the base, the bending part has a second section, and the area of the second section is smaller than that of the first section. An isotropous stress release effect is achieved, and the reliability is improved.

Description

technical field [0001] The present invention relates to the technical field of power devices, in particular to a packaging terminal, a packaging module with the packaging terminal, and a manufacturing method of the packaging terminal. Background technique [0002] With the continuous improvement of power system requirements for efficiency, power density, reliability, and installation convenience. The development of power devices is also developing from discrete devices to modularization. Power modules have become one of the important development directions of the power electronics industry. Since more power semiconductor chips are integrated inside, some even integrate logic, control, detection and protection circuits, making power devices more convenient to use, not only reducing system size and development time, but also greatly enhancing system reliability . [0003] However, due to the harsh environment in which the products are used, power electronic products will su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H01L21/60
CPCH01R13/05H01L2224/48472H01L2224/49111H01R12/57Y10T29/49204H01R43/16
Inventor 王献明洪守玉
Owner DELTA ELECTRONICS SHANGHAI CO LTD
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