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An integrated multi-module device that facilitates heat dissipation

A multi-module and equipment technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve problems such as poor heat dissipation and affect product reliability, achieve good heat dissipation and avoid equipment instability

Active Publication Date: 2016-08-24
HUAWEI MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide an integrated multi-module device that is good for heat dissipation, which can solve the problem that in the current integrated multi-module device, each module is arranged horizontally, the heat dissipation is not good, and cascade heating will be formed between each module, which affects product reliability. The problem

Method used

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  • An integrated multi-module device that facilitates heat dissipation
  • An integrated multi-module device that facilitates heat dissipation
  • An integrated multi-module device that facilitates heat dissipation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] An embodiment of the present invention provides an integrated multi-module device that facilitates heat dissipation, such as image 3 As shown, the device includes: multiple sub-modules, a backplane and a frame;

[0029] Wherein, the backplane is arranged in the frame;

[0030] A plurality of sub-modules are arranged and installed on the backboard at intervals, and each sub-module is arranged obliquely at an included angle with the horizontal direction, and oblique heat dissipation channels at an included angle with the horizontal direction are formed between adjacent sub-modules.

[0031] In the above device, the multiple submodules are arranged in one or more rows on the backplane; further, the multiple submodules in one or more rows can be arranged horizontally or vertically on the backplane.

[0032] In the above-mentioned equipment, the two adjacent sub-modules forming the same oblique heat dissipation channel among the multiple sub-modules in the same row are par...

Embodiment 2

[0046] Figure 7 As shown, the device (frame 20 is not shown) is installed vertically in two rows on the backplane with multiple sub-modules, Figure 8 As shown, two rows of multiple submodules are installed horizontally on the backplane (the frame body 20 is shown, and the backplane is set in the frame body 20). Each submodule in each row of submodules 22 is obliquely installed on the backplane On the board 21, the module connectors on the backplane 21 can be installed obliquely according to the angle required for heat dissipation, and then install each sub-module through the module connectors, so that each sub-module is arranged in two rows obliquely on the backplane, and the same row An oblique heat dissipation channel 23 is formed between adjacent sub-modules, and the oblique heat dissipation channel facilitates heat dissipation through natural convection.

[0047] The sub-modules in the same row can be spaced differently according to different heating effects. For exampl...

Embodiment 3

[0051] This embodiment provides an integrated multi-module device that facilitates heat dissipation, which is formed on the basis of the first and second embodiments above, such as Figure 9 As shown, the device includes: a plurality of sub-modules 22, a backplane 21, a second cooling channel 25 and a frame;

[0052] Wherein, the backboard 21 is arranged in the frame;

[0053] A plurality of sub-modules 22 are arranged at intervals and installed on the backplane 21, and each sub-module 22 is arranged obliquely at an included angle with the horizontal direction, and oblique heat dissipation channels 24 at an included angle with the horizontal direction are formed between adjacent sub-modules ;

[0054] The second heat dissipation channel 25 communicates with the oblique heat dissipation channels formed between the sub-modules.

[0055] In the above-mentioned equipment, there are one or more second heat dissipation channels 25, and each second heat dissipation channel is a lon...

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Abstract

The invention discloses multi-module-integrated equipment facilitating heat dissipation and belongs to the field of equipment heat dissipation. The equipment comprises a plurality of sub modules, a backboard and a frame body, wherein the backboard is arranged in the frame body; the plurality of sub modules are arranged at intervals on the backboard; each sub module is arranged obliquely in a way that an included angle is formed between each sub module and the horizontal direction; and an oblique heat dissipation channel is formed between adjacent sub modules and the oblique heat dissipation channel and the horizontal direction form an included angle. As the plurality of sub modules are arranged at intervals on the backboard, each sub module is arranged obliquely in a way that an included angle is formed between each sub module and the horizontal direction, and the oblique heat dissipation channel is formed between adjacent sub modules and the oblique heat dissipation channel and the horizontal direction form an included angle, air convection can be made full use of via the oblique heat dissipation channels, good heat dissipation of the equipment is thus realized, the problem that the equipment is instable as the upper sub modules overheat as a result of the cascade heating effect can be solved.

Description

technical field [0001] The invention relates to the field of equipment heat dissipation, in particular to integrated multi-module equipment that facilitates heat dissipation. Background technique [0002] In some current electronic equipment (such as communication equipment, computer equipment, server equipment, etc.), multiple sub-modules are generally integrated, and the installation of multiple sub-modules is usually stacked, so that the bottom sub-module and the top sub-module are stacked. It will bring about multi-module cooling cascading problems. For example, take XX equipment as an example, where multiple sub-modules (XX boards) are set on the backboard, such as figure 1 single-row vertical installation shown and figure 2 In the multi-row vertical installation method, multiple sub-modules are arranged horizontally, and are arranged in one or more rows at intervals from top to bottom and installed on the backplane. The channel is a horizontal channel, and the hori...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 校敏奇张召冯踏青
Owner HUAWEI MACHINERY