A kind of halogen-free resin composition and prepreg and laminated board prepared therefrom
A resin composition and prepreg technology, used in integrated circuit packaging, electronic materials, high-frequency, high-speed and high-density interconnection fields, can solve the problems of increasing moisture absorption rate and decreasing electrical properties, and achieve improved moisture and heat resistance. The effect of good damp heat resistance and low dielectric constant
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Synthetic example 1
[0050] Preparation 1 of phosphorus-containing active ester compound:
[0051] Weigh 0.6mol of 10-(2,5-dihydroxyphenyl)-10-hydrogen-9-oxa-10-phosphaphenanthrene-10-oxide and 0.6mol of p-hydroxybenzaldehyde, add 65% mass Concentration of H 2 SO 4 , condensed and refluxed at 100°C for 3 to 5 hours, and then the mixture was washed with alcohol 4 to 6 times to obtain the pre-product; the above-mentioned pre-product was dissolved in toluene solution, and 0.2mol of benzoic acid was added. temperature conditions, add 0.05mol catalyst (AlCl 3 ), condensed and refluxed for 4 hours, and then after several times of washing, dried for 4 hours under vacuum at 105°C to obtain the desired phosphorus-containing active ester compound with an esterification rate of 70-80% and a phosphorus content of 6.4%. Phosphorus-containing active ester compound, denoted as C1, the specific structure is as follows:
[0052]
[0053] X= , Y=H, Z= , R is phenyl, R1=CH 3 , n is 3~5.
[0054] The NMR...
Synthetic example 2
[0060] Synthesis of Allyl Modified Bismaleimide Prepolymer
[0061] React 100 parts of 4,4'-diphenylmethane bismaleimide resin with 50 parts of diallyl bisphenol A compound at 135°C for 80 minutes, then cool to room temperature to obtain the desired olefin Propyl modified bismaleimide resin prepolymer A1, its molecular weight is 2000~4000g / mol;
[0062] React 100 parts of 4,4'-diphenyl ether bismaleimide resin with 100 parts of diallyl bisphenol A allyl compound at 155°C for 50 minutes, then cool to room temperature to obtain the obtained The desired allyl-modified bismaleimide resin prepolymer A2 has a molecular weight of 4001-6000 g / mol.
Embodiment
[0064] According to the weight ratio shown in Table 1, allyl modified bismaleimide prepolymer, epoxy resin, phosphorus-containing active ester compound, curing agent, curing accelerator, inorganic filler and solvent are added to the mixing tank , control the solid content of the glue to 65%, stir evenly, and ripen for 8hr to make a resin composition glue; then impregnate the glass cloth in the above resin composition glue; then soak the glass cloth after 155~ Baking at 175°C for 4~7 minutes to form a prepreg; cut the prepreg to a certain size and stack 8 prepregs to form a stack, place an electrolytic copper foil on the top and bottom of the stack, and send it to a vacuum press Medium pressing, the program is 150°C / 60min+200°C / 120min, to make a laminate.
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