Protruding point of package substrate and manufacturing method of protruding point

Abstract

The invention belongs to the technical field of integrated circuit package and discloses a manufacturing method of a protruding point of a package substrate. The method comprises the steps that an inter-layer circuit is manufactured on the package substrate; electroless copper plating is conducted on the surface of the package substrate; electroplating is conducted on an electroless copper plating layer over the inter-layer circuit so that the cylindrical protruding point can be formed; the portions, outside the range of the protruding point and at the bottom of an inner cavity of the protruding point, of the electroless copper plating layer are etched; the inner wall of the protruding point is filled with low-melting-point solder. The protruding point is directly manufactured on the inner-layer copper circuit, operation complexity is reduced, and the technological process is simplified; meanwhile, the height of the cylindrical protruding point is easy to control and consistency is good; the solder capacity is large and the soldering performance is good.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a bump of a packaging substrate and a manufacturing method thereof. Background technique [0002] In the process of electroplating bumps, since bump electroplating is completed in a dry film pattern with a high aspect ratio, it is difficult to obtain a flat pattern structure on the top of the bumps due to the small aperture of the bump window after the bumps are formed after electroplating. Usually, this electroplating process needs to connect the electrodes of all electroplating bumps together through wires to form electroplating lines. After electroplating the bumps, all the electroplating lines need to be etched away before the quality inspection of the substrate can be carried out; the process is complex, Plating bump height control is difficult. [0003] see figure 1 , In the existing bump structure, the appearance shape of the bump has a great influen...

AI Technical Summary

Problems solved by technology

Usually, this electroplating process needs to connect the electrodes of all electroplating bumps together through wires to form electroplating lines. After electroplating the bumps, all the electroplating lines need to be etched away before the quality inspection of the substrate can be carried out; the process is complex, It is difficult to control the height of plating bumps

[0003] see figure 1 , In the existing bump structure, the appearance shape of the bump has a great influence on the subsequent assembly. If the shape of the copper bump is consistent, the height and shape consistency will be very good after solder reflow. If the shape is inconsistent, the solder height will be stable. There will be problems, and the overall flattening treatment is required. Therefore, the consistency and surface morphology of the electroplated copper bumps are relatively high.

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