Shaping apparatus and shaping method for chassis
A shaping device and chassis technology, applied in the direction of support structure installation, forming tools, electrical equipment casing/cabinets/drawers, etc., can solve the problems of affecting internal electronic components, occupying the inner space of the chassis, and the lower chassis cannot be opened, etc., to achieve great applicability range, the effect of reducing production costs
Inactive Publication Date: 2014-10-15
WISTRON CORP
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Problems solved by technology
Accordingly, when the components on the motherboard need to be maintained or repaired due to failures, the weight of the components will cause the upper chassis to deform in the direction of gravity and interfere with the lower chassis, resulting in the situation that the lower chassis cannot be opened.
One of the existing solutions is to additionally process the bottom of the chassis into a convex structure, but this will occupy the internal space of the chassis and affect the arrangement of internal electronic components; the second existing solution is to additionally install metal parts on the bottom of the chassis To reinforce, but this will increase the cost and riveting combination process
Method used
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[0050] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described with reference to the accompanying drawings.
[0051] figure 1 is a schematic diagram of a shaping device according to an embodiment of the present invention. Please refer to figure 1 , the shaping device 100 is used to perform a shaping process on the chassis 200 of the server, so that the chassis 200 can obtain a preset deformation, so as to counteract the generation of the electronic components on the chassis 200 due to gravity when the relevant electronic components (not shown) are subsequently loaded. deformation. Here, the structural features of the shaping device 100 will be described first, and its usage will be further explained later.
[0052] In this embodiment, the chassis 200 has a bottom plate 210, and the bottom plate 210 has an inner surface S1 and an outer...
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A shaping apparatus of the invention is used for shaping a chassis and includes a machine body, a first die, a second die and a plurality of shaping members. The first die is disposed at a side of the machine body and the chassis is suitable to be placed and positioned at the first die. The second die is disposed at another side of the machine body. The machine body drives the second die to move relatively to the first die so that the second die moves close to or far away from the first die. The shaping members are detachably assembled to at least one of the first die and the second die so that when the first die and the second die approach each other, the shaping members press and deform the chassis thereon. A shaping method for a chassis is also disclosed.
Description
technical field [0001] The invention relates to a shaping device and a shaping method, and in particular to a shaping device and a shaping method for a chassis. Background technique [0002] In recent years, the development of computer servers has gradually developed from a traditional vertical server that is large and takes up space to several 1U (U refers to the thickness of a rack-mounted server in the server field, 1U=4.445cm) The height of the host is placed in the rack server (Rack Server) that is managed uniformly in the cabinet. [0003] Generally speaking, each server unit in a rack server is slidably arranged in a cabinet. Based on this concept, the entire device servo system can be regarded as a large cabinet, and multiple The drawer (i.e. the chassis) of the server unit placed horizontally. The server units in the drawers are connected to each other, so as to increase the multiplexing of the generated servers and achieve high computing performance. [0004] Fu...
Claims
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IPC IPC(8): B21D37/10B21D1/00
CPCB21D22/02H05K5/00B21D22/10Y10T29/49623H05K7/1485B21D37/02
Inventor 林世隆陈大卫
Owner WISTRON CORP