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Multilayer ceramic capacitors and boards for mounting multilayer ceramic capacitors

A technology of multilayer ceramics and capacitors, applied in the direction of multilayer capacitors, multiple fixed capacitors, fixed capacitor dielectrics, etc.

Active Publication Date: 2017-05-03
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, in the case of using such a material with high resistance in the external electrodes, localized hot spots resulting in current crowding effect are generated due to pinholes

Method used

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  • Multilayer ceramic capacitors and boards for mounting multilayer ceramic capacitors
  • Multilayer ceramic capacitors and boards for mounting multilayer ceramic capacitors
  • Multilayer ceramic capacitors and boards for mounting multilayer ceramic capacitors

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Embodiment Construction

[0070] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0071] However, the present invention can be realized in various ways, and should not be construed as being limited to the embodiments listed hereinafter. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0072] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same or similar reference numerals will be used throughout to designate the same or like elements.

[0073] The directions of the hexahedron are defined to clearly describe the embodiments of the present invention. L, W, and T shown in the drawings refer to a length direction, a width direction, and a thickness direction, respectively. Here, the thickness direction may be the direction in which the dielectric layer...

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Abstract

PROBLEM TO BE SOLVED: To provide a configuration which enables ESR characteristic of a multi-layered ceramic capacitor for decoupling to be easily adjusted so that flat impedance characteristic of a power distribution network is materialized.SOLUTION: The multi-layered ceramic capacitor includes: a first external electrode 1 and a second external electrode 2 which are formed on a first side surface of a ceramic body; a third external electrode 3 and a fourth external electrode 4 which are formed on a second side surface; a first capacitor part C1 which is formed in the ceramic body and includes first and second internal electrodes connected to the first and second external electrodes 1, 2; and a second capacitor part C2 including third and fourth internal electrodes connected to the third and fourth external electrodes 3, 4. The multi-layered ceramic capacitor further includes first and second internal connection conductors R1, R2 which are formed in the ceramic body and connected in series to the first and second capacitor parts C1, C2. The third and fourth external electrodes 3, 4 are used for connection to a power supply line, and the first and second external electrodes 1, 2 are non-contact terminals.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2013-0044156 filed with the Korean Intellectual Property Office on Apr. 22, 2013, the disclosure of which is incorporated herein by reference. technical field [0003] The present invention relates to a multilayer ceramic capacitor and a board on which the multilayer ceramic capacitor is mounted. Background technique [0004] A multilayer ceramic capacitor, a multilayer chip (chip) electronic component, is a chip mounted on printed circuit boards of various electronic products such as display devices, computers, smartphones, mobile phones, etc. for charging and discharging shape capacitor, and the display device is, for example, a liquid crystal display (LCD), a plasma display panel (PDP), and the like. [0005] Since such multilayer ceramic capacitors (MLCCs) have advantages such as small size, high capacitance, and easy mounting, they may be used...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/30H01G4/38H05K1/18
CPCH01G2/06H01G4/12H01G4/30H01G4/385
Inventor 朴珉哲朴兴吉
Owner SAMSUNG ELECTRO MECHANICS CO LTD